Datasheet

PMEG4050EP_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 September 2009 10 of 13
NXP Semiconductors
PMEG4050EP
5 A low V
F
MEGA Schottky barrier rectifier
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000
PMEG4050EP SOD128 4 mm pitch, 12 mm tape and reel -115
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOD128
solder lands
solder resist
occupied area
solder paste
2.53.4
2.1
(2×)
1.9
(2×)
4.4
4.2
6.2
1.2
(2×)
1.4
(2×)
sod128_fr
Dimensions in mm