Datasheet

PESDXL4UF_G_W_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 28 February 2008 14 of 17
NXP Semiconductors
PESDxL4UF/G/W
Low capacitance unidirectional quadruple ESD protection diode arrays
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint PESDxL4UW (SOT665)
2.45
2.10
0.30
0.15
(2x)
0.375
(2
×)
0.45
(2
×)
0.70
(2×)
0.40
(5
×)
0.55
1.60
1.20
2.20
1.25
1.375
2.00 1.70 1.00
solder lands
solder resist
placement area
occupied area
0.075
Dimensions in mm