Datasheet

PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 9 of 12
NXP Semiconductors
PESD1CAN
CAN bus ESD protection diode
10. Soldering
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
sot023
4.004.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands