Datasheet

PDTC114E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 12 — 21 December 2011 4 of 17
NXP Semiconductors
PDTC114E series
NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
(1) SOT23; FR4 PCB, standard footprint
SOT883; FR4 PCB with 70 m copper strip line, standard footprint
(2) SOT323; FR4 PCB, standard footprint
(3) SOT416; FR4 PCB, standard footprint
Fig 1. Power derating curves
T
amb
(°C)
-75 17512525 75-25
006aac778
100
200
300
P
tot
(mW)
0
(1)
(2)
(3)
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from junction
to ambient
in free air
PDTC114EE (SOT416)
[1][2]
--830K/W
PDTC114EM (SOT883)
[2][3]
--500K/W
PDTC114ET (SOT23)
[1]
--500K/W
PDTC114EU (SOT323)
[1]
--625K/W