Datasheet

LPC15XX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 February 2014 53 of 99
NXP Semiconductors
LPC15xx
32-bit ARM Cortex-M3 microcontroller
Table 10. Thermal resistance value (C/W): ±15 %
Symbol Parameter Conditions Typ Unit
LQFP48
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 64 C/W
1 m/s 55 C/W
2.5 m/s 50 C/W
8-layer (4.5 in  3 in)
0 m/s 96 C/W
1 m/s 76 C/W
2.5 m/s 67 C/W
jc thermal resistance
junction-to-case
13 C/W
jb thermal resistance
junction-to-board
16 C/W
LQFP64
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 51 C/W
1 m/s 45 C/W
2.5 m/s 41 C/W
8-layer (4.5 in  3 in)
0 m/s 75 C/W
1 m/s 60 C/W
2.5 m/s 54 C/W
jc thermal resistance
junction-to-case
13 C/W
jb thermal resistance
junction-to-board
17 C/W
LQFP100
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 42 C/W
1 m/s 37 C/W
2.5 m/s 34 C/W
8-layer (4.5 in  3 in)
0 m/s 59 
C/W
1 m/s
48 C/W
2.5 m/s 44 C/W
jc thermal resistance
junction-to-case
12 C/W
jb thermal resistance
junction-to-board
17 C/W