Datasheet

NXP Semiconductors
NX7002AK
60 V, single N-channel Trench MOSFET
NX7002AK All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 6 August 2015 12 / 16
13. Soldering
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
Fig. 19. Reflow soldering footprint for TO-236AB (SOT23)
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
Fig. 20. Wave soldering footprint for TO-236AB (SOT23)