Datasheet

Dimensions
8.1 Obtaining package dimensions
Package dimensions are provided in package drawings.
To find a package drawing, go to nxp.com and perform a keyword search for the
drawing’s document number:
Package Body size Pitch NXP document number
621 FC-BGA 17 mm x 17 mm 0.65 mm 98ASA00819D
Pinouts
9.1
Package pinouts and signal descriptions
For package pinouts and signal descriptions, refer to the Reference Manual.
10
Reset sequence
This section describes different reset sequences and details the duration for which the
device remains in reset condition in each of those conditions.
10.1
Reset sequence duration
Table 66 specifies the minimum and the maximum reset sequence duration for the five
different reset sequences described in Reset sequence description.
Table 66. RESET sequences
1
No. Symbol Parameter T
Reset
Unit
Min Typ Max
1 T
DRB
Destructive Reset Sequence, All LBIST/MBIST enabled 25 — ~50 ms
2 T
DR
Destructive Reset Sequence, BIST disabled 50 — 90 µs
3 T
ERLB
External Reset Sequence Long, Unsecure Boot, BIST enabled 25 — ~50 ms
Table continues on the next page...
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9
Dimensions
S32V234 Data Sheet, Rev. 8, 01/2019
76 NXP Semiconductors