Datasheet

Table of Contents
1 Block diagram.................................................................................... 5
2 Family comparison.............................................................................5
2.1 Feature Set...............................................................................5
3 Ordering parts.....................................................................................8
3.1 Ordering information...............................................................8
4 General............................................................................................... 8
4.1 Operation above maximum operating conditions................... 8
4.2 Recommended operating conditions....................................... 9
4.3 Power Management Controller (PMC) electrical
specifications...........................................................................10
4.4 Power consumption.................................................................11
4.5 Electrostatic discharge (ESD) specifications.......................... 13
4.6 Electromagnetic Compatibility (EMC) specifications............ 13
4.7 PCB routing guidelines........................................................... 13
5 I/O parameters....................................................................................15
5.1 General purpose I/O parameters..............................................15
5.1.1 GPIO speed at various voltage levels........................15
5.1.2 DC electrical specifications.......................................17
5.2 DDR pads................................................................................ 18
5.2.1 DDR3 mode...............................................................18
5.2.1.1 DDR3 mode DC electrical
specifications......................................... 18
5.2.2 DDR3L mode............................................................ 18
5.2.2.1 DDR3L mode DC electrical
specifications......................................... 18
5.2.3 LPDDR2 mode..........................................................19
5.2.3.1 LPDDR2 mode DC electrical
specifications......................................... 19
5.3 Boot Configuration Pins Specification....................................19
6 Peripheral operating requirements and behaviors..............................20
6.1 Analog modules.......................................................................20
6.1.1 ADC electrical specifications....................................20
6.1.1.1 Input equivalent circuit..........................21
6.1.2 Thermal Monitoring Unit (TMU)..............................23
6.2 Clocks and PLL interfaces modules........................................23
6.2.1 Main oscillator electrical characteristics................... 23
6.2.2 48 MHz FIRC electrical characteristics.................... 24
6.2.3 PLL electrical specifications..................................... 24
6.2.4 DFS electrical specifications.....................................25
6.2.5 LFAST PLL Electrical Specifications.......................25
6.3 Memory interfaces...................................................................26
6.3.1 QuadSPI AC specifications.......................................26
6.4 DDR SDRAM Specific Parameters (DDR3, DDR3L, and
LPDDR2)................................................................................ 31
6.4.1 DDR3 and DDR3L timing parameters .....................31
6.4.2 DDR3 and DDR3L read cycle...................................33
6.4.3 DDR3 and DDR3L write cycle................................. 34
6.4.4 LPDDR2 timing parameter........................................35
6.4.5 LPDDR2 read cycle...................................................37
6.4.6 LPDDR2 write cycle................................................. 38
6.5 Communication modules.........................................................39
6.5.1 DSPI timing...............................................................39
6.5.2 Ultra High Speed SD/SDIO/MMC Host Interface
(uSDHC)....................................................................43
6.5.2.1 SDR mode timing specifications........... 43
6.5.2.2 DDR mode timing specifications...........45
6.5.3 LFAST electrical characteristics............................... 48
6.5.3.1 LFAST interface timing diagrams.........48
6.5.3.2 LFAST Interface electrical
characteristics........................................ 49
6.5.4 FlexRay......................................................................50
6.5.4.1 FlexRay timing parameters....................50
6.5.4.2 TxEN......................................................50
6.5.4.3 TxD........................................................51
6.5.4.4 RxD........................................................52
6.5.5 Ethernet Controller (ENET) Parameters................... 53
6.5.5.1 Ethernet Switching Specifications.........53
6.5.5.2 Receive and Transmit signal timing
specifications for RMII interfaces......... 53
6.5.5.3 Receive and Transmit signal timing
specifications for MII interfaces............54
6.5.5.4 Receive and Transmit signal timing
specifications for RGMII interfaces...... 56
6.5.5.5 MII/RMII Serial Management channel
timing (MDC/MDIO)............................ 57
6.5.6 PCI Express specifications........................................ 58
6.5.7 IIC timing.................................................................. 59
6.5.8 LINFlex timing..........................................................60
6.6 Display modules......................................................................61
6.6.1 Display Control Unit (2D-ACE) Parameters.............61
S32V234 Data Sheet, Rev. 8, 01/2019
NXP Semiconductors 3