Datasheet

Table of Contents
1 Introduction...............................................................................3
1.1 Features summary..........................................................3
1.2 Block diagram..................................................................4
2 Pinouts......................................................................................5
2.1 416-ball MAPBGA pin assignments................................5
2.2 516-ball MAPBGA pin assignments................................6
3 Electrical characteristics............................................................7
3.1 Absolute maximum ratings..............................................7
3.2 Electromagnetic interference (EMI) characteristics.........9
3.3 Electrostatic discharge (ESD) characteristics.................9
3.4 Operating conditions.......................................................9
3.5 DC electrical specifications.............................................12
3.6 I/O pad specifications......................................................13
3.6.1 Input pad specifications..................................13
3.6.2 Output pad specifications...............................15
3.6.3 I/O pad current specifications.........................19
3.7 Oscillator and PLL electrical specifications.....................19
3.7.1 PLL electrical specifications...........................20
3.7.2 Oscillator electrical specifications..................21
3.8 Analog-to-Digital Converter (ADC) electrical
specifications...................................................................23
3.8.1 Enhanced Queued Analog-to-Digital
Converter (eQADC)........................................23
3.8.2 Sigma-Delta ADC (SDADC)...........................25
3.9 Temperature Sensor.......................................................34
3.10 LVDS Fast Asynchronous Serial Transmission (LFAST)
pad electrical characteristics...........................................34
3.10.1 LFAST interface timing diagrams...................34
3.10.2 LFAST and MSC/DSPI LVDS interface
electrical characteristics.................................36
3.10.3 LFAST PLL electrical characteristics.............39
3.11 Power management: PMC, POR/LVD, power
sequencing......................................................................40
3.11.1 Power management electrical characteristics40
3.11.2 Power management integration.....................43
3.11.3 Device voltage monitoring..............................44
3.11.4 Power sequencing requirements....................46
3.12 Flash memory specifications...........................................47
3.12.1 Flash memory program and erase
specifications..................................................48
3.12.2 Flash memory Array Integrity and Margin
Read specifications........................................48
3.12.3 Flash memory module life specifications.......49
3.12.4 Data retention vs program/erase cycles.........50
3.12.5 Flash memory AC timing specifications.........50
3.12.6 Flash memory read wait-state and address-
pipeline control settings..................................51
3.13 AC timing.........................................................................52
3.13.1 Generic timing diagrams................................52
3.13.2 Reset and configuration pin timing.................53
3.13.3 IEEE 1149.1 interface timing..........................54
3.13.4 Nexus timing..................................................57
3.13.5 External Bus Interface (EBI) timing................59
3.13.6 External interrupt timing (IRQ/NMI pin)..........63
3.13.7 eTPU timing...................................................64
3.13.8 eMIOS timing.................................................65
3.13.9 DSPI timing with CMOS and LVDS pads.......66
3.13.10 FEC timing.....................................................78
4 Package information.................................................................83
4.1 Thermal characteristics...................................................83
4.1.1 General notes for thermal characteristics......84
5 Ordering information.................................................................87
6 Document revision history.........................................................88
MPC5777C Microcontroller Data Sheet Data Sheet, Rev. 13, 08/2018.
2 NXP Semiconductors