Datasheet

i.MX RT1015 Crossover Processors Data Sheet for Consumer Products, Rev. 0.1, 03/2019
36 NXP Semiconductors
Electrical characteristics
Figure 14. Trace data specifications
4.5 External memory interface
The following sections provide information about external memory interfaces.FlexSPI parameters
Measurements are with a load 15 pf and input slew rate of 1 V/ns.
4.5.1 FlexSPI input/read timing
There are four sources for the internal sample clock for FlexSPI read data:
• Dummy read strobe generated by FlexSPI controller and looped back internally
(FlexSPIn_MCR0[RXCLKSRC] = 0x0)
• Dummy read strobe generated by FlexSPI controller and looped back through the
DQS pad (FlexSPIn_MCR0[RXCLKSRC] = 0x1)
• Read strobe provided by memory device and input from DQS pad
(FlexSPIn_MCR0[RXCLKSRC] = 0x3)
The following sections describe input signal timing for each of these four internal sample clock sources.
4.5.1.0.1 SDR mode with FlexSPIn_MCR0[RXCLKSRC] = 0x0, 0x1
Table 30. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X0
Symbol Parameter Min Max Unit
— Frequency of operation — 60 MHz
T
IS
Setup time for incoming data 8.67 — ns
T
IH
Hold time for incoming data 0 — ns
Table 31. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X1
Symbol Parameter Min Max Unit
— Frequency of operation — 133 MHz
T
IS
Setup time for incoming data 2 — ns
T
IH
Hold time for incoming data 1 — ns
T8
T7 T7
T8
ARM_TRACE_CLK
ARM_TRACE0-3