Datasheet

i.MX RT1015 Crossover Processors Data Sheet for Consumer Products, Rev. 0.1, 03/2019
18 NXP Semiconductors
Electrical characteristics
— Starts up quicker than 32 kHz crystal oscillator
• External crystal oscillator with on-chip support circuit:
— At power up, ring oscillator is utilized. After crystal oscillator is stable, the clock circuit
switches over to the crystal oscillator automatically.
— Higher accuracy than ring oscillator
— If no external crystal is present, then the ring oscillator is utilized
The decision of choosing a clock source should be taken based on real-time clock use and precision
time-out.
4.1.5 Maximum supply currents
The data shown in Table 12 represent a use case designed specifically to show the maximum current
consumption possible. All cores are running at the defined maximum frequency and are limited to L1
cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a very limited
practical use case, if at all, and be limited to an extremely low duty cycle unless the intention was to
specifically show the worst case power consumption.
See the i.MX RT1015 Power Consumption Measurement Application Note for more details on typical
power consumption under various use case definitions.
Table 12. Maximum supply currents
Power Rail Conditions Max Current Unit
DCDC_IN Max power for FF chip at 125
o
C80 mA
VDD_HIGH_IN Include internal loading in analog 50 mA
VDD_SNVS_IN — 250 A
USB_OTG1_VBUS 25 mA for each active USB interface 25 mA
VDDA_ADC_3P3 3.3 V power supply for 12-bit ADC, 600
A typical, 750 A max, for each ADC.
100 Ohm max loading for touch panel,
cause 33 mA current.
40 mA
NVCC_GPIO Imax = N x C x V x (0.5 x F)
Where:
N—Number of IO pins supplied by the power line
C—Equivalent external capacitive load
V—IO voltage
(0.5 x F)—Data change rate. Up to 0.5 of the clock rate (F).
In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.