Datasheet

Electrical characteristics
i.MX RT1015 Crossover Processors Data Sheet for Consumer Products, Rev. 0.1, 03/2019
NXP Semiconductors 15
4.1.2 Thermal resistance
Following sections provide the thermal resistance data.
4.1.2.1 14 x 14 mm package thermal resistance
Table 8 displays the 14 x 14 mm LQFP package thermal resistance data.
ESD Damage Immunity:
Human Body Model (HBM)
Charge Device Model (CDM)
Vesd
—
—
1000
500
V
Input/Output Voltage range V
in/Vout
-0.5 OVDD + 0.3
1
V
Storage Temperature range T
STORAGE
-40 150
o
C
1
OVDD is the I/O supply voltage.
Table 8. 14 x 14 mm package thermal resistance data
Rating Test Conditions Symbol Value Unit Notes
Junction to Ambient
Natural convection
Single-layer board (1s) R
JA
63
o
C/W
1,2
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2
Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or
2s2p board, respectively.
Junction to Ambient
Natural convection
Four-layer board (2s2p) R
JA
52
o
C/W
1,2
Junction to Ambient (@200
ft/min)
Single layer board (1s) R
JMA
53
o
C/W
1,3
3
Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or
2s2p board, respectively.
Junction to Ambient (@200
ft/min)
Four layer board (2s2p) R
JMA
46
o
C/W
1,3
Junction to Board — R
JB
36
o
C/W
4
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Junction to Case — R
JC
19
o
C/W
5
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Junction to Package Top Natural Convection 
JT
3
o
C/W
6
6
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 7. Absolute maximum ratings (continued)