Datasheet
i.MX RT CROSSOVER MCUs | PORTFOLIO FEATURES 
Feature i.MX RT1010 i.MX RT1015 i.MX RT1020 i.MX RT1050 i.MX RT1060/RT1064 i.MX R T1170
Core/Speed Cortex-M7 @ 500 
MHz
Cortex-M7 @ 500 
MHz
Cortex-M7 @ 500 
MHz
Cortex-M7 @ 600 
MHz
Cortex-M7 @ 600 MHz Cortex-M7 @ 1GHz, 
Cortex-M4@ 400 MHz
Cache 16 KB-I, 8 KB-D 16 KB-I, 16 KB-D 16 KB-I, 16 KB-D 32 KB-I, 32 KB-D 32 KB-I, 32 KB-D 32 KB-I, 32 KB-D
TCM Up to 128 KB Up to 128 KB Up to 256 KB Up to 512 KB Up to 512 KB Up to 512 KB
On-chip RAM 128 KB 128 KB 256 KB 512 KB 1 MB 2 MB
On-chip Flash - - - - Up to 4 MB -
External Memory - - 8-/16-bit interface 
for SDRAM, SRAM, 
NOR, NAND
8-/16-bit interface 
for SDRAM, SRAM, 
NOR, NAND
8-/16-bit interface for 
SDRAM, SRAM, NOR, 
NAND
8-/16-/32-bit interface 
for SDRAM, SRAM, 
NOR, NAND
Quad/Octal SPI/ 
HyperBus
Dual-channel/8-bit Dual-channel/8-
bit
Dual-channel/8-bit Dual-channel/8-bit Up to 2 x Dual-channel/8-
bit
1 x Dual-channel/8-bit 
1 x Dual-channel/16-
bit
SDIO - - SD3.0/eMMC4.5 x 2 SD3.0/eMMC4.5 x 2 SD3.0/eMMC4.5 x 2 SD3.0/eMMC5.0 x 2
Ethernet - - 10/100 Mbit/s x 1 w/ 
IEEE 1588
10/100 Mbit/s x 1 w/ 
IEEE 1588
10/100 Mbit/s x 2 w/ IEEE 
1588
1Gbit/s w/ AVB + 
1Gbit/s w/ TSN + 
10/100 Mbit/s w/ 
IEEE 1588
USB with PHY OTG, HS/FS x 1 OTG, HS/FS x 1 OTG, HS/FS x 1 OTG, HS/FS x 2 OTG, HS/FS x 2 OTG, HS/FS x 2
CAN - - FlexCAN x 2 FlexCAN x 2 FlexCAN x 2 + CANFD 
x 1
CAN-FD x 3
Graphics - - - PxP for 2D 
acceleration
PxP for 2D acceleration PxP for 2D 
acceleration, 2D GPU 
with vector graphics 
acceleration
CSI - - - 8-/10-/16-bit parallel 8-/10-/16-bit parallel 8-/10-/16- bit parallel, 
2-lane MIPI CSI
LCD - - - 8-/16-/18-/24-bit 
parallel
8-/16-/18-/24-bit parallel 8-/16-/18-/24-bit 
parallel, 2-lane MIPI 
DSI
Security TRNG, AES-128, 
SHA, 
Secure Boot
TRNG, AES-128, 
SHA, 
Secure Boot
TRNG, AES-128, 
SHA, 
Secure Boot
TRNG, AES-128, 
SHA, 
Secure Boot
TRNG, AES-128, SHA, 
Secure Boot
TRNG,AES-128/256, 
SHA, Secure Boot, 
RSA4096, DES/3DES, 
Tamper Detection 
PUF, UDF, Secure 
RAM
UART/SPI/I
2
C/FlexIO 4/2/2/1 4/2/2/1 8/4/4/1 8/4/4/2 8/4/4/3 12/6/6/2
I
2
S/SPDIF 2/1 3/1 3/1 3/1 3/1 4/1
ADC 1M sample/s x 1 1M sample/s x 1 1M sample/s x 2 1M sample/s x 2 1M sample/s x 2 2M sample/s x 2
ACMP/DAC - - 4/- 4/- 4/- 4/1
FlexPWM/Quad 
Timer/ Quad ENC
1/0/0 1/1/1 2/2/2 4/4/4 4/4/4 4/4/4
GP Timer / WDOG 3/4 6/4 6/4 6/4 6/4 6/4
Package 80 LQFP 100 LQFP 100 LQFP, 144 LQFP 196 BGA 196 BGA 289 BGA
Temperature (Tj) Consumer:  
0 to 95 °C 
Industrial:  
-40 to 105 °C 
Consumer:  
0 to 95 °C 
Industrial:  
-40 to 105 °C 
Consumer:  
0 to 95 °C 
Industrial:  
-40 to 105 °C 
Consumer:  
0 to 95 °C 
Industrial:  
-40 to 105 °C 
Consumer:  
0 to 95 °C 
Industrial:  
-40 to 105 °C 
Consumer:  
0 to 95 °C 
Industrial:  
-40 to 105 °C 
Automotive:  
-40 to 125 ºC 
MEMORY EXPANSION WITH i.MX RT
i.MX RT crossover MCUs shed the 
burden of on-chip flash, which not only 
reduces the cost, but it also enables 
higher frequency operation for increased 
performance—which in turn lets you 
boost capabilities, increase efficiency 
and add more features. The i.MX RT 
FlexSPI interface provides memory 
expansion for external memories such 
as serial Flash / PSRAM, Quad or Octal 
data lines. This offers maximum design 
flexibility, while still ensuring a high-level 
of performance and security. The i.MX 
RT series integrates high densities of 
SRAM, which is further configured within 
the crossover design architecture to 
function as TCM with ‘zero-wait’ single 
cycle access to dramatically increase 
system performance. This key design 
feature enables the crossover processor’s 
effective performance to be significantly 
better than any traditional MCU 
counterpart.




