Datasheet

MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131 6 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
8. Chip orientation and bond pad locations
(1) The air gap may vary due to varying foil expansion
(2) Measured from outer sealring edge (see detail)
All dimensions in μm
Fig 4. Chip orientation and bond pad locations
001aam20
1
Bump size
LA, LB
VSS, TP1, TP2
Chip Step
69
58
1231
(1)
69
x (μm) y (μm)
58
1280
(1)
LATP1
TP2 VSS
LB
typ. 15.0
(1)
min. 5.0
typ. 36.4
(1)(2)
min. 26.4
typ. 15.0
(1)
min. 5.0
1071.0
(2)
typ. 36.4
(1)(2)
min. 26.4
Y
X
1070.0
(2)
52.3
(2)
51.3
(2)
239.2
(2)
368.7
(2)
556.6
(2)
807.7
(2)
1231.0
(1)
1280.0
(1)
52.9
(2)
Dimensions in μm