Datasheet

MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131 4 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
6. Pinning information
6.1 Smart card contactless module
7. Mechanical specification
Fig 3. Contact assignments for SOT500-2 (MOA4)
Table 2. Bonding pad assignments to smart card contactless module
Contactless interface module MF1S5009DA4
Antenna contacts Symbol Description
LA LA Antenna coil connection LA
LB LB Antenna coil connection LB
001aam20
0
top viewLA LB
Table 3. Specifications
Wafer
diameter 200 mm typical (8 inches)
maximum diameter after foil expansion 210 mm
thickness 120 μm ± 15 μm
flatness not applicable
Potential Good Dies per Wafer (PGDW)
18482
Wafer backside
material Si
treatment
ground and stress relieve
roughness R
a
max = 0.2 μm
R
t
max = 2 μm
Chip dimensions
step size x = 1231 μm
y = 1280 μm