Datasheet
MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131 3 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
3. Applications
Public transportation
Access management
Electronic toll collection
Car parking
School and campus cards
Employee cards
Internet cafés
Loyalty
4. Ordering information
5. Block diagram
Table 1. Ordering information
Type number Package
Commerci
al Name
Name Description Version
MF1S5009DUD FFC - 8 inch wafer, 120 μm thickness, on film
frame carrier, electronic fail die
marking according to SECS-II format)
-
MF1S5009DA4 MOA4 PLLMC plastic leadless module carrier
package; 35 mm wide tape
SOT500-2
Fig 2. Block diagram
001aal73
2
RF
INTERFACE
UART
ISO/IEC
14443A
LOGIC UNIT CRC
EEPROM
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR