Datasheet

MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131 26 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
14. Package outline
Fig 20. Package outline SOT500-2
UNIT D
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
35.05
34.95
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
DIMENSIONS (mm are the original dimensions)
SOT500-2
03-09-17
06-05-22
- - - - - -- - -
P
LLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-
2
A
(1)
max.
0.33
0 10 20 mm
scale
A
detail X
X
Note
1. Total package thickness, exclusive punching burr.
D