Datasheet

ManualsBrandsNXP ManualsofficeMF1S5009DA4

1. General description

NXP Semiconductors has developed the MIFARE MF1S5009 to be used in a contactless

smart card according to ISO/IEC 14443 Type A. The MF1S5009 features a double size

UID for early adopters among existing MIFARE Classic systems which are planning to

migrate from the currently used single size UID to double size UID.

The MIFARE MF1S5009 IC is used in applications like public transport ticketing where

major cities have adopted MIFARE as their e-ticketing solution of choice.

1.1 Key applications

• Public transportation

• Access control

• Event ticketing

• Gaming and identity

1.2 Anticollision

An intelligent anticollision function allows to operate more than one card in the field

simultaneously. The anticollision algorithm selects each card individually and ensures that

the execution of a transaction with a selected card is performed correctly without data

corruption resulting from other cards in the field.

1.3 Simple integration and user convenience

The MF1S5009 is designed for simple integration and user convenience which could

allow complete ticketing transactions to be handled in less than 100 ms. Thus, the

MF1S5009 card user is not forced to stop at the reader leading to a high throughput at

gates and reduced boarding times onto busses.

MF1S5009

Mainstream contactless smart card IC for fast and easy

solution development

Rev. 3 — 27 July 2010

189131

Product data sheet

PUBLIC

Fig 1. MIFARE card reader

001aam19

MIFARE

CARD PCD

energy

data

Summary of content (32 pages)

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MF1S5009 Mainstream contactless smart card IC for fast and easy solution development Rev. 3 — 27 July 2010 189131 Product data sheet PUBLIC 1. General description NXP Semiconductors has developed the MIFARE MF1S5009 to be used in a contactless smart card according to ISO/IEC 14443 Type A. The MF1S5009 features a double size UID for early adopters among existing MIFARE Classic systems which are planning to migrate from the currently used single size UID to double size UID.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 1.4 Security • Unique identifier for each device using double size UID (7 byte UID) • Mutual three pass authentication (ISO/IEC 9798-2) • Individual set of two keys per sector (per application) to support multi-application with key hierarchy 1.5 Delivery options • Bumped die on wafer • MOA4 contactless module 2. Features and benefits 2.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 3. Applications Public transportation Access management Electronic toll collection Car parking School and campus cards Employee cards Internet cafés Loyalty 4. Ordering information Table 1.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 6. Pinning information 6.1 Smart card contactless module LA top view LB 001aam200 Fig 3. Contact assignments for SOT500-2 (MOA4) Table 2. Bonding pad assignments to smart card contactless module Contactless interface module MF1S5009DA4 Antenna contacts Symbol Description LA LA Antenna coil connection LA LB LB Antenna coil connection LB 7. Mechanical specification Table 3.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Table 3. Specifications typical = 15 μm gap between chips[1] minimum = 5 μm Passivation type sandwich structure material nitride thickness 1.75 μm Au bump (substrate connected to VSS) > 99.9 % pure Au material hardness 35 to 80 HV 0.005 shear strength >70 MPa height 18 μm height uniformity within a die = ±2 μm within a wafer = ±3 μm wafer to wafer = ±4 μm flatness minimum = ±1.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 8. Chip orientation and bond pad locations x (μm) y (μm) Bump size LA, LB VSS, TP1, TP2 69 58 69 58 Chip Step 1231(1) 1280(1) typ. 15.0(1) min. 5.0 typ. 36.4(1)(2) min. 26.4 typ. 36.4(1)(2) min. 26.4 typ. 15.0(1) min. 5.0 TP1 LA 52.3(2) 239.2(2) 1280.0(1) 1071.0(2) 1070.0(2) 51.3(2) TP2 VSS LB 52.9(2) Y 368.7(2) 556.6(2) X 807.7(2) 1231.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9. Functional description 9.1 Block description The MF1S5009 chip consists of a 1 kB EEPROM, RF interface and Digital Control Unit. Energy and data are transferred via an antenna consisting of a coil with a small number of turns which is directly connected to the MF1S5009. No further external components are necessary. Refer to the document Ref. 1 for details on antenna design.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.2.3 Select card With the select card command the reader selects one individual card for authentication and memory related operations. The card returns the Select Acknowledge (SAK) code which determines the type of the selected card, see Section 10.4. For further details refer to the document Ref. 2, the handling of double size UIDs in MIFARE Classic is described in Ref. 6. 9.2.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.2.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.5 RF interface The RF-interface is according to the standard for contactless smart cards ISO/IEC 14443 A. The carrier field from the reader is always present (with short pauses when transmitting), because it is used for the power supply of the card. For both directions of data communication there is only one start bit at the beginning of each frame. Each byte is transmitted with a parity bit (odd parity) at the end.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.6.1 Manufacturer block This is the first data block (block 0) of the first sector (sector 0). It contains the IC manufacturer data. This block is programmed and write protected in the production test. Block 0/Sector 0 Byte 0 1 2 3 4 5 6 7 8 9 UID Fig 7. 10 11 12 13 Manufacturer Data 14 15 001aam204 Manufacturer block 9.6.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.6.3 Sector trailer (block 3) Each sector has a sector trailer containing the • secret keys A and B (optional), which return logical “0”s when read and • the access conditions for the four blocks of that sector, which are stored in bytes 6...9. The access bits also specify the type (read/write or value) of the data blocks. If key B is not needed, the last 6 bytes of block 3 can be used as data bytes.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.7.1 Access conditions The access conditions for every data block and sector trailer are defined by 3 bits, which are stored non-inverted and inverted in the sector trailer of the specified sector. The access bits control the rights of memory access using the secret keys A and B. The access conditions may be altered, provided one knows the relevant key and the current access condition allows this operation.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 9.7.2 Access conditions for the sector trailer Depending on the access bits for the sector trailer (block 3) the read/write access to the keys and the access bits is specified as ‘never’, ‘key A’, ‘key B’ or key A|B’ (key A or key B). On chip delivery the access conditions for the sector trailers and key A are predefined as transport configuration.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Table 7.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 10. Command overview The MIFARE card activation follows the ISO/IEC 14443-3 type A. After the MIFARE card has been selected, it can either be deactivated using the ISO/IEC 14443 Halt command, or the MIFARE commands can be performed. For more details about the card activation refer to Ref. 4. 10.1 MIFARE command overview All MIFARE Classic commands use the MIFARE Crypto1 and require an authentication.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC All timing can be measured according to ISO/IEC 14443-3 frame specification as shown for the Frame Delay Time in Figure 11. For more details refer to Ref. 3 and Ref. 4. FDTPCD2PICC = Frame delay time PCD to PICC. FDTPICC2PCD = Frame delay time PICC to PCD (must be at least 87 μS).
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 10.4 ATQA and SAK responses For details on the type identification procedure please refer to Ref. 2. The MF1S5009 answers to a REQA or WUPA command with the ATQA value shown in Table 10 and to a Select CL1 command with the SAK value shown in Table 11. Table 10. ATQA response of the MF1S5009 Bit Number Response Hex Value 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 ATQA 00 44h 0 0 0 1 0 0 0 1 0 0 Table 11.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 11. MIFARE classic commands 11.1 MIFARE Authentication The MIFARE authentication is a 3-pass mutual authentication which needs two pairs of command-response. These two parts, MIFARE authentication part 1 and part 2 are shown in Figure 12, Figure 13 and Table 12. Table 13 shows the required timing. PCD Auth Addr CRC Token RB PICC ,,ACK'' 368 μs 359 μs TACK NAK PICC TNAK ,,NAK'' 59 μs TTimeOut Time out 001aam209 Fig 12.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Table 12. MIFARE authentication command Name Code Description Length Auth (with Key A) 60h Authentication with Key A 1 byte Auth (with Key B) 61h Authentication with Key B 1 byte Addr - MIFARE Block address (00h to FFh) 1 byte CRC - CRC according to Ref.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Table 14. MIFARE Read command Name Code Description Length Cmd 30h Read one block 1 byte Addr - MIFARE Block address (00h to FFh) 1 byte CRC - CRC according to Ref. 4 2 bytes Data - Data content of the addressed block 16 bytes NAK see Table 9 see Section 10.3 4-bit Table 15. MIFARE Read timing These times exclude the end of communication of the PCD.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC PCD Data CRC ACK PICC 1558 μs ,,ACK'' 59 μs TACK NAK PICC 59 μs TNAK ,,NAK'' TTimeOut Time out 001aam213 Fig 16. MIFARE Write part 2 Table 16. MIFARE Write command Name Code Description Length Cmd A0h Read one block 1 byte Addr - MIFARE Block or Page address (00h to FFh) 1 byte CRC - CRC according to Ref. 4 2 bytes Data - Data 16 bytes NAK see Table 9 see Section 10.3 4-bit Table 17.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC PCD Cmd Addr CRC ACK PICC 368 μs ,,ACK'' 59 μs TACK NAK PICC 59 μs TNAK ,,NAK'' TTimeOut Time out 001aam214 Fig 17. MIFARE Increment, Decrement and Restore part 1 PCD Data CRC PICC 538 μs ,,ACK'' NAK PICC TNAK ,,NAK'' 59 μs TTimeOut Time out 001aam215 (1) Increment, Decrement and Restore part 2 does not acknowledge Fig 18. MIFARE Increment, Decrement and Restore part 2 Table 18.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Table 19. MIFARE Increment, Decrement and Restore timing These times exclude the end of communication of the PCD.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Table 20. MIFARE Transfer command Name Code Description Length Cmd B0h Write value into destination block 1 byte Addr - MIFARE destination block address (00h to FFh) 1 byte CRC - CRC according to Ref. 4 2 bytes NAK see Table 9 see Section 10.3 4-bit Table 21. MIFARE Transfer timing These times exclude the end of communication of the PCD.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 14. Package outline PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-2 X D A detail X 0 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max. D mm 0.33 35.05 34.95 For unspecified dimensions see PLLMC-drawing given in the subpackage code. Note 1. Total package thickness, exclusive punching burr.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 15. Abbreviations Table 24.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 17. Revision history Table 25. Revision history Document ID Release date Data sheet status Change notice Supersedes MF1S5009 v.3.1 20100727 Product data sheet - MF1S5009 v.3.0 - - Modifications: MF1S5009 v.3.0 MF1S5009 Product data sheet PUBLIC • All drawings updated 20100610 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 July 2010 189131 © NXP B.V. 2010.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 20. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Ordering information . . . . . . . . . . . . . . . . . . . . .3 Bonding pad assignments to smart card contactless module . . . . . . . . . . . . . . . . . . . . . . .4 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Memory operations . . . . . . . . . . . . . . . . . . . . . .
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MF1S5009 NXP Semiconductors Mainstream contactless smart card IC 22. Contents 1 1.1 1.2 1.3 1.4 1.5 2 2.1 2.2 3 4 5 6 6.1 7 7.1 8 9 9.1 9.2 9.2.1 9.2.2 9.2.3 9.2.4 9.2.5 9.3 9.4 9.5 9.6 9.6.1 9.6.2 9.6.2.1 9.6.3 9.7 9.7.1 9.7.2 9.7.3 10 10.1 10.2 10.3 10.4 11 11.1 11.2 11.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Key applications . . . . . . . . . . . . . . . . . . . . . . . . 1 Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . .