Datasheet

Electrical characteristics
i.MX 8QuadXPlus and 8DualXPlus Automotive and Infotainment Applications Processors, Rev. 0, 11/2018
PRELIMINARYNXP Semiconductors 17
4.1.3 Operating Ranges
The following table provides the operating ranges of these processors.
Junction to Ambient
1
Single-layer board (1s); air flow 200
ft/min
4
R
θJMA
17.6 20.0 °C/W
Four-layer board (2s2p); air flow 200
ft/min
4
R
θJMA
10.5 11.0 °C/W
Junction to Board
1,5
—R
θJB
2.9 2.1 °C/W
Junction to Case (top)
1,6
—R
θJCtop
0.7 0.9 °C/W
1
Per JEDEC JESD51-2, the intent of thermal resistance measurements is solely for a thermal performance comparison of
one package to another in a standardized environment. This methodology is not meant to and does not predict the
performance of a package in an application-specific environment.
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
3
Per JEDEC JESD51-3 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified
package.
4
Per JEDEC JESD51-6 with the board horizontal.
5
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
6
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the
interface layer.
Table 6. Operating ranges
1
Symbol Description Mode Min Typ Max Unit Comments
VDD_A35 Power supply of
Cortex-A35 cluster
Overdrive 1.05 1.10 1.15 V Max frequency: 1.2 GHz
Nominal 0.95 1.00 1.10 V Max frequency: 900 MHz
VDD_GPU Power supply of
GPU instance
Overdrive 1.05 1.10 1.15 V Max frequencies:
Shaders: 850MHz
Core: 700 MHz
Nominal 0.95 1.00 1.10 V Max frequencies:
shaders: 372 MHz;
core: 372 MHz
VDD_MAIN Power supply of
remaining core
logic
N/A 0.95 1.00 1.10 V Max freq.: HiFi4 DSP
640 MHz
Max freq.: M4 264 MHz
Max freq.: VPU 600 MHz
Table 5. FCPBGA package thermal resistance data
1
(continued)
Thermal Parameter Test Conditions Symbol
21x21 mm
package
17x17 mm
package
Unit