Datasheet
Package information and contact assignments
i.MX 8QuadXPlus and 8DualXPlus Automotive and Infotainment Applications Processors, Rev. 0, 11/2018
PRELIMINARY NXP Semiconductors126
6.2 FCPBGA, 17 x 17 mm, 0.8 mm pitch
This section includes the following:
• Mechanical package drawing
• Ball map for case FCPBGA, 17 x 17 mm, 0.8 mm pitch
• Contact assignments