Datasheet

Modules List
i.MX 8QuadXPlus and 8DualXPlus Automotive and Infotainment Applications Processors, Rev. 0, 11/2018
PRELIMINARY NXP Semiconductors12
SNVS Secure Non-Volatile
Storage
Secure Non-Volatile Storage, including Secure Real Time Clock, Security State
Machine, Master Key Control, and Violation/Tamper Detection and reporting.
SPDIF Sony Philips Digital
Interconnect Format
The Sony/Philips Digital Interface (SPDIF) audio block is a stereo transceiver that
allows the processor to receive and transmit digital audio. The SPDIF transceiver
allows the handling of both SPDIF channel status (CS) and User (U) data and
includes a frequency measurement block that allows the precise measurement of
an incoming sampling frequency.
TEMPMON Temperature Monitor The temperature monitor/sensor IP module for detecting high temperature
conditions. The temperature read out does not reflect case or ambient temperature.
It reflects the temperature in proximity of the sensor location on the die.
Temperature distribution may not be uniformly distributed; therefore, the read-out
value may not be the reflection of the temperature value for the entire die.
UART UART Interface • High-speed TIA/EIA-232-F compatible, up to 5.0 Mbps
• Serial IR interface low-speed, IrDA-compatible (up to 115.2 Kbit/s)
• 9-bit or Multidrop mode (RS-485) support (automatic slave address detection)
• 7, 8, 9, or 10-bit data characters (7-bits only with parity)
• 1 or 2 stop bits
• Programmable parity (even, odd, and no parity)
• Hardware flow control support for request to send (RTS_B) and clear to send
(CTS_B) signals
USB3/USB2 The USB3/USB2 OTG module has been specified to perform USB 3.0 dual role and
USB 2.0 On-The-Go (OTG) compatible with the USB 3.0, and USB 2.0
specification with OTG supplementary specifications. This controller supports
twoindependent USB cores (1
× USB3.0 dual-role, 1 × USB2.0 OTG) and includes
the PHY and I/O interfaces to support this operation. The full pinout of the USB 3.0
controller includes the signaling for both USB 3.0 and USB 2.0. This does not
mean there is a separate USB 2.0 controller that can be used independently and
simultaneously with USB 3.0. This device has an additional separate,
independent USB 2.0 OTG controller which can be used simultaneously with this
USB 3.0. Specific features requested for this updated module:
• Super Speed (5 Gbps), High Speed (480 Mbps), full speed (12 Mbps) and low
speed (1.5 Mbps)
• Fully compatible with the USB 3.0 specification (backward compatible with USB
2.0)
• Fully compatible with the USB On-The-Go supplement to the USB 2.0
specification
• Hardware support for OTG signaling
• Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)
implemented in hardware, which can also be controlled by software
Table 2. i.MX 8QuadXPlus/8DualXPlus modules list (continued)
Block
Mnemonic
Block Name Brief Description