Datasheet
Package information and contact assignments
i.MX 8QuadXPlus and 8DualXPlus Automotive and Infotainment Applications Processors, Rev. 0, 11/2018
PRELIMINARYNXP Semiconductors 109
6 Package information and contact assignments
This section contains package information and contact assignments for the following package(s):
• FCPBGA 21 x 21 mm, 0.8 mm pitch
• FCPBGA 17 x 17 mm, 0.8 mm pitch
6.1 FCPBGA, 21 x 21 mm, 0.8 mm pitch
This section includes the following information for the 21 x 21 mm, 0.8 mm pitch package:
• Mechanical package drawing
•Ball map
• Contact assignments