Datasheet

Package information and contact assignments
i.MX 8QuadXPlus and 8DualXPlus Automotive and Infotainment Applications Processors, Rev. 0, 11/2018
PRELIMINARY NXP Semiconductors110
6.1.1 21 x 21 mm package case outline
The following figure shows the top, bottom, and side views of the 21 x 21 mm package.
Figure 58. 21 x 21 mm Package Top, Bottom, and Side Views