Datasheet

i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors Data Sheet for Industrial Products, Rev. 0, 01/2018
72 NXP Semiconductors
Package information and contact assignments
5 Package information and contact assignments
This section includes the contact assignment information and mechanical package drawing.
5.1 17 x 17 mm package information
5.1.1 17 x 17 mm, 0.65 mm pitch, ball matrix
Figure 44 shows the top, bottom, and side views of the 17 × 17 mm BGA package.