Datasheet

Electrical characteristics
i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors Data Sheet for Industrial Products, Rev. 0, 01/2018
NXP Semiconductors 69
Table 76 shows the external component values.
Table 77 shows the minimum ESD protection target levels.
Table 78 shows the supply impedance requirements.
USB1/2_VPTX PHY transmit supply 0.9 V (+22.2%, -7%)
USB1/2_VDD33 High supply for high-speed operation IO 3.3 V (+10%, -7%)
USB1/2_VPH High supply for SuperSpeed operation IO 3.3 V (+10%, -7%)
Table 76. External component values
Component Pin Name Value
External resistor (resref) USB1_RESREF/USB2_RESREF 200 (±1%)
Table 77. Minimum ESD protection target levels
ESD Category Minimum Protection Level JEDEC Class
Human Body Model (HBM) (JS-001-2014) 2 KV 2
Charged Device Model (CDM) (JESD22-C101F) 6 A peak discharge current C2/C1 (500 V/ 250 V)
1
1
Support for either 500 V or 250 V CDM target level is dependent on maximum discharge current generated in final
SoC/package implementation.
Machine Model (MM) (JESD22_A115C) 100 V N/A
Table 78. Supply impedance requirements
L
gd
+ L
vp
(nH)
L
VSSA
<#> +
L
DVDD
(nH)
L
gd
+ L
vptx
<#>(nH)
L
VSSA
<#> + L
VDD33
<#>(nH)
L
gd
+ L
vph
(nH)
< 2.4 < 2.4 < 2.4 < 2.8 < 2.8
Table 75. USB power pin supplies (continued)
Pin Name Description Value