Datasheet

i.MX 6UltraLite EVK Board Hardware User’s Guide, Rev. 1, 03/2016
Freescale Semiconductor, Inc. 19
PCB information
3 PCB information
Both the base board and main board are made using standard 4-layer technology. The material used was
FR-4.
The PCB stack-up information is shown in the following table.
Table 7. Board stack-up information
Base board Main board
Layer Description
Copper
(Oz)
Dielectric
Thickness
(mil)
Layer Description
Copper
(Oz)
Dielectric
Thickness
(mil)
1 Signal 1 — 1 Signal 1 —
Dielectric — 3.0 Dielectric — 3
2GND1— 2GND1—
Dielectric — 36 Dielectric — 28
3 Power 1 — 3 Power 1 —
Dielectric — 3.0 Dielectric — 3
4 Signal 1 — 4 Signal 1 —