Datasheet

MC33411A/B
42
MOTOROLA RF/IF DEVICE DATA
FTA SUFFIX
PLASTIC PACKAGE
CASE 932–02
(LQFP–48)
ISSUE E
OUTLINE DIMENSIONS
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÉÉÉ
A
A1
Z
0.200 AB T–U
4X
Z0.200 AC T–U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
P
AE AE
T, U, Z
DETAIL Y
DETAIL Y
BASE METAL
N
J
F
D
T–U
M
0.080 ZAC
SECTION AE–AE
AD
G
0.080 AC
M
_
TOP & BOTTOM
L
_
W
K
AA
E
C
H
0.250
R
9
DETAIL AD
NOTES:
1 DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5 DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.
T
U
Z
AB
AC
GAUGE PLANE
DIM
A
MIN MAX
7.000 BSC
MILLIMETERS
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M 12 REF
N 0.090 0.160
P 0.250 BSC
L 1 5
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
_
__
ARCHIVE INFORMATION
ARCHIVE INFORMATION
Fr
eescale S
emiconduct
or
, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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