Datasheet

8 NXP Semiconductors

10XS3435

THERMAL RESISTANCE

Thermal resistance

(8)

• Junction to Case

• Junction to Ambient

θJC

θJA

<1.0

°C/ W

Peak Package Reflow Temperature During Reflow

(9)

(10)

PPRT

Note 10

°C

Notes

8. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of R

θJA

can be reached in a real application case (4 layers board).

9. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

malfunction or permanent damage to the device.

10. NXP’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and

Moisture Sensitivity Levels (MSL), go to

www.nxp.com, search by part number (remove prefixes/suffixes) and enter the core ID to view all

orderable parts, and review parametrics.

Table 4. Maximum ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage

to the device.

Ratings Symbol Value Unit