Datasheet

48 NXP Semiconductors
10XS3435
9 Packaging
9.1 Soldering information
The 10XS3435 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board.
The AN2467 provides guidelines for printed circuit board design and assembly.
9.2 Package dimensions
For the most current package revision, visit www.nxp.com and perform a keyword search using the 98ARL10596D listed below.
Dimensions shown are provided for reference ONLY.
FK SUFFIX
24-PIN PQFN
NONLEADED PACKAGE
98ARL10596D
REV. D