Datasheet

NXP Semiconductors 3
10XS3435
1 Orderable parts
2 Device variations
Table 1. Orderable part variations
Part number(1) Temperature Package
MC10XS3435BHFK
- 40 to 125 °C 24-pin PQFN
MC10XS3435DHFK
Notes
1. To order parts in tape and reel, add the R2 suffix to the part number.
Table 2. Device variations
Characteristic Symbol Min Typ Max Unit
Wake input clamp voltage, I
CL(WAKE)
< 2.5 mA
• 10XS3435B
• 10XS3435D
V
CL(WAKE)
18
20
25
27
32
35
V
Fault detection blanking time
• 10XS3435B
• 10XS3435D
t
FAULT
-
-
5.0
5.0
20
10
μs
Output shutdown delay time
• 10XS3435B
• 10XS3435D
t
DETECT
-
-
7.0
7.0
30
20
μs
Peak Package Reflow Temperature During Reflow
(2)
,
(3)
T
PPRT
Note 3 °C
Notes
2. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), go to
www.nxp.com, search by part number (remove prefixes/suffixes) and enter the core ID to view all
orderable parts, and review parametrics.