Datasheet

LPC84x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet Rev. 1.7 — 27 February 2018 91 of 97
NXP Semiconductors
LPC84x
32-bit Arm Cortex-M0+ microcontroller
Fig 49. Reflow soldering of the HVQFN48 package (7x7)
SOT619-1Footprint information for reflow soldering of HVQFN48 package
Dimensions in mm
Ax Ay Bx By D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy
8.000 8.000 6.200 6.200
P
0.500 0.290
C
0.900 5.100 5.100 3.000 3.000 0.750 0.750 7.300 7.300 8.250 8.250
nSPx nSPy
33
sot619-1_fr
occupied area
Ax
Bx
SLx
Gx
Gy
Hy
Hx
AyBySLy
P 0.025
0.025
D
(0.105)
SPx tot
SPy t ot
nSPx
nSPy
SPx
SPy
solder land plus solder paste
solder land
solder paste deposit
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
Issue date
07-05-07
09-06-15