Datasheet

LPC84x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet Rev. 1.7 — 27 February 2018 86 of 97
NXP Semiconductors
LPC84x
32-bit Arm Cortex-M0+ microcontroller
16. Soldering
Fig 44. Reflow soldering for the LQFP48 package
SOT313-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP48 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1
D2 (8×)
D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
10.350
P2
0.560 10.350 7.350 7.350
P1
0.500 0.280
C
1.500 0.500 7.500 7.500 10.650 10.650
sot313-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2