Datasheet

LPC84x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet Rev. 1.7 — 27 February 2018 4 of 97
NXP Semiconductors
LPC84x
32-bit Arm Cortex-M0+ microcontroller
4. Ordering information
4.1 Ordering options
Table 1. Ordering information
Type number Package
Name Description Version
LPC845M301JBD64 LQFP64 Plastic low profile quad flat package; 64 leads; body 10 10  1.4 mm SOT314-2
LPC845M301JBD48 LQFP48 Plastic low profile quad flat package; 48 leads; body 7 7  1.4 mm SOT313-2
LPC845M301JHI48 HVQFN48 HVQFN: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 7  0.85 mm
SOT619-1
LPC845M301JHI33 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 5  5  0.85 mm
SOT617-11
LPC844M201JBD64 LQFP64 Plastic low profile quad flat package; 64 leads; body 10 10  1.4 mm SOT314-2
LPC844M201JBD48 LQFP48 Plastic low profile quad flat package; 48 leads; body 7 7  1.4 mm SOT313-2
LPC844M201JHI48 HVQFN48 HVQFN: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7  7  0.85 mm
SOT619-1
LPC844M201JHI33 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 5  5  0.85 mm
SOT617-11
Table 2. Ordering options
Type number Flash/KB SRAM/KB USART I
2
C SPI DAC Capacitive
Touch
GPIO Package
LPC845M301JBD64 64 16 5 4 2 2 yes 54 LQFP64
LPC845M301JBD48 64 16 5 4 2 2 yes 42 LQFP48
LPC845M301JHI48 64 16 5 4 2 2 yes 42 HVQFN48
LPC845M301JHI33 64 16 5 4 2 1 - 29 HVQFN33
LPC844M201JBD64 64 8 2 2 2 - - 54 LQFP64
LPC844M201JBD48 64 8 2 2 2 - - 42 LQFP48
LPC844M201JHI48 64 8 2 2 2 - - 42 HVQFN48
LPC844M201JHI33 64 8 2 2 2 - - 29 HVQFN33