Datasheet
LPC55S6x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2019. All rights reserved.
Product data sheet Rev. 1.0 — 26 February 2019 72 of 123
NXP Semiconductors
LPC55S6x
32-bit ARM Cortex-M33 microcontroller
[1] Typical ratings are not guaranteed. Typical values listed are at room temperature (25 C), 3.3 V.
[2] Clock source FRO. PLL disabled
[3] Characterized through bench measurements using typical samples.
[4] Compiler settings: IAR v.8.20.2., optimization level 0, optimized for time off.
[5] Flash is powered down
[1] Typical ratings are not guaranteed. Typical values listed are at room temperature (25 C).
[2] Characterized through bench measurements using typical samples. VBAT_DCDC = 3.0 V
[3] Tested in production, VBAT_DCDC = 3.6 V
ARM Cortex-M33 (CPU0) in sleep mode; ARM Cortex-M33 (CPU1) in sleep mode
I
DD
supply current CCLK = 12 MHz, PLL disabled
[2][3][6]
- <tbd> - mA
CCLK = 96 MHz, PLL disabled
[2][3][6]
- <tbd> - mA
Table 16. Static characteristics: Power consumption in active and sleep modes
T
amb
= 40 C to +105 C, unless otherwise specified. VBAT_DCDC = 3.0 V
Symbol Parameter Conditions Min Typ
[1]
Max Unit
Table 17. Static characteristics: Power consumption in deep-sleep, power-down, and deep power-down modes
T
amb
= 40 C to +105 C, 1.8 V VBAT_DCDC 3.6 V; unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1][2]
Max
[3]
Unit
I
DD
supply current Deep-sleep mode; all SRAM
on
[2]
-
110
<tbd>
A
Power-down mode.
[2]
SRAM_X2 (4 KB) powered - 4.0 <tbd> A
SRAM_X2 and SRAM_X3
(8 KB) powered
-
3.9 -
A
320 KB full retention
powered
-
15.4 -
A
Deep power-down mode;
RTC oscillator input
grounded (RTC oscillator
disabled, 4 KB SRAM
powered)
T
amb
= 25 C
[2]
- 590 <tbd> nA
T
amb
= 105 C - <tbd> <tbd> A
RTC oscillator running with
external crystal (4 KB
SRAM powered)
- 790 - nA