Datasheet

LPC55S6x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2019. All rights reserved.
Product data sheet Rev. 1.0 — 26 February 2019 66 of 123
NXP Semiconductors
LPC55S6x
32-bit ARM Cortex-M33 microcontroller
8. Limiting values
Table 11. Limiting values <tbd>
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD
Main IO supply
[2]
-0.3 3.96 V
VBAT_DCDC Supply of DCDC output
stage. DCDC core
supply (references and
regulation stages)
[2]
-0.3 3.96 V
VBAT_PMU Analog supply
[2]
-0.3 3.96 V
VDD_PMU Analog supply for Core.
DCDC output set to 1.1
V by default
[2]
-0.3 1.26 V
USB0_3V3 USB0 analog 3.3 V
supply.
[2]
-0.3 3.96 V
USB1_3V3 USB1 analog 3.3 V
supply.
[2]
-0.3 3.96 V
V
DDA
Analog supply voltage
for ADC
[2]
-0.3 3.96 V
V
refp
ADC positive reference
voltage
[2]
-0.3 3.96 V
V
I
input voltage only valid when the V
DD
≥ 1.8 V
[6][7]
0.5 V
DD
+ 0.5 V
V
I
input voltage on I2C open-drain pins
[5]
0.5 V
DD
+ 0.5 V
USB_DM,
USB_DP pins
0.3 USB_3V3 +
0.5
V
V
IA
analog input voltage on digital pins configured for an
analog function
[8][9]
-0.3 3.96 V
I
DD
total supply current per supply pin
[3]
- <tbd> mA
I
SS
total ground current per ground pin
[3]
- <tbd> mA
I
latch
I/O latch-up current (0.5V
DD
) < V
I
< (1.5V
DD
);
T
j
< 125 C
- 100 mA
T
stg
storage temperature
[10]
-65 +150 C
P
tot(pack)
total power dissipation
(per package)
HLQFP100, based on package
heat transfer, not device power
consumption
[11]
- <tbd> W
P
tot(pack)
total power dissipation
(per package)
HLQFP100, based on package
heat transfer, not device power
consumption
[12]
- <tbd> W
P
tot(pack)
total power dissipation
(per package)
VFBGA98, based on package
heat transfer, not device power
consumption
[11]
- <tbd> W