Datasheet
LPC540xx All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet Rev. 1.8 — 22 June 2018 92 of 168
NXP Semiconductors
LPC540xx
32-bit ARM Cortex-M4 microcontroller
[1] Typical ratings are not guaranteed. Typical values listed are at room temperature (25 C), VDD = 3.3 V.
[2] Characterized through bench measurements using typical samples.
[3] Tested in production, VDD = 3.6 V.
[1] Typical ratings are not guaranteed. Typical values listed are at room temperature (25 C).
[2] Characterized through bench measurements using typical samples.
[3] If VBAT> VDD, the external reset pin must be floating to prevent high VBAT leakage.
Table 16. Static characteristics: Power consumption in deep-sleep and deep power-down modes
T
amb
=
40
C to +105
C, unless otherwise specified, 2.2 V
V
DD
3.6 V.
Symbol Parameter Conditions Min Typ
[1][2]
Max
[3]
Unit
I
DD
supply current Deep-sleep mode:
SRAMX (64 KB) powered
T
amb
=25 C
-55 175A
SRAMX (64 KB) powered
T
amb
= 105 C
- - 2020 A
Deep power-down mode
RTC oscillator input grounded (RTC oscillator
disabled)
T
amb
=25 C
- 891 1.6 A
RTC oscillator input grounded (RTC oscillator
disabled)
T
amb
=105C
-- 42 A
RTC oscillator running with external crystal
VDD = VDDA= VREFP = 3.3 V, VBAT = 3.0 V
- 660 - nA
Table 17. Static characteristics: Power consumption in deep power-down mode
T
amb
=
40
C to +105
C, unless otherwise specified, 2.7 V
V
DD
3.6 V.
Symbol Parameter Conditions Min Typ
[1][2]
Max Unit
I
BAT
battery supply
current
deep power-down mode;
RTC oscillator running with external crystal
VDD = VDDA= VREFP = 3.3 V, VBAT = 3.0 V - 0 - nA
VDD = VDDA= VREFP = 0 V or tied to ground, VBAT =
3.0 V
- 380
[3]
-nA