Datasheet

LPC540xx All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet Rev. 1.8 — 22 June 2018 163 of 168
NXP Semiconductors
LPC540xx
32-bit ARM Cortex-M4 microcontroller
18. Revision history
Table 58. Revision history
Document ID Release date Data sheet status Change notice Supersedes
LPC540xx v.1.8 20180622 Product data sheet - v.1.7
Modifications: • Updated Figure 13 “Typical CoreMark score ((iterations/s)/MHz) vs. Frequency (MHz)
from SRAMX”
• Updated Table 4 “Pin description””: Description of VREFN and VSSA.
• Updated Table 5 “Termination of unused pins”: Added USB1_ID pin.
• Updated Table 13 “CoreMark score”, Typical values.
LPC540xx v.1.7 20180426 Product data sheet - v.1.6
Modifications:
• Updated Table 4 “Pin description”: VREFN and VSSA.
LPC540xx v.1.6 20180417 Product data sheet - v.1.5
Modifications:
• Added LPC54016JET100 TFBGA100 device.
• Updated Table 22 “Dynamic characteristic: Typical wake-up times from low power
modes”: Changed t
wake
at typical for deep-sleep mode to 150 s. Was 19 s.
• Updated Section 2 “Features and benefits”. Added text for full-speed USB crystal-less
software library: See Technical note TN00033 for more details.
LPC540xx v.1.5 20180227 Product data sheet - v.1.4
Modifications:
• Updated Table 6 “Pin states in different power modes”: Added table note 3: If VBAT>
VDD, the external reset pin must be floating to prevent high leakage.
• Updated Table 15 “Static characteristics: Power consumption in deep-sleep and deep
power-down modes”: 1.71 V £ V
DD
 2.2 V. Added table note: At hot temperature and
below 2.0 V, the supply current increases slightly because of reduction of available
RBB (reverse body bias) voltage.
• Updated Table 16 “Static characteristics: Power consumption in deep-sleep and deep
power-down modes”: 1.71 V £ V
DD
 2.2 V.
• Updated Table 17 “Static characteristics: Power consumption in deep power-down
mode”: Added table note 3: If VBAT> VDD, the external reset pin must be floating to
prevent high leakage.
• Updated Figure 15 “Deep-sleep mode: Typical supply current IDD versus temperature
for different supply voltages VDD”: added remark: At hot temperature and below 2.0 V,
the supply current increases slightly because of reduction of available RBB (reverse
body bias) voltage.
• Added Section 11.14 “SPI interfaces (Flexcomm Interface 10)”.
LPC540xx v.1.4 20180206 Product data sheet - v.1.3
Modifications:
• Updated Figure 3 “LQFP100 package marking”.
LPC540xx v.1.3 20180126 Product data sheet - v.1.2