LPC540xx 32-bit ARM Cortex-M4 microcontroller; 360 kB SRAM; High-speed USB device/host + PHY; Full-speed USB device/host; Ethernet AVB; LCD; EMC; SPIFI; CAN FD, SDIO; 12-bit 5 Msamples/s ADC; DMIC subsystem Rev. 1.8 — 22 June 2018 Product data sheet 1. General description The LPC540xx is a family of ARM Cortex-M4 based microcontrollers for embedded applications featuring a rich peripheral set with very low power consumption and enhanced debug features.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller LPC540xx Product data sheet General-purpose One-Time Programmable (OTP) memory for user application specific data ROM API support: In-Application Programming (IAP) and In-System Programming (ISP). ROM-based USB drivers (HID, CDC, MSC, and DFU).
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller LPC540xx Product data sheet Up to 171 General-Purpose Input/Output (GPIO) pins. GPIO registers are located on the AHB for fast access. The DMA supports GPIO ports. Up to eight GPIOs can be selected as Pin Interrupts (PINT), triggered by rising, falling or both input edges. Two GPIO Grouped Interrupts (GINT) enable an interrupt based on a logical (AND/OR) combination of input states.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller LPC540xx Product data sheet Clock output function with divider. Frequency measurement unit for measuring the frequency of any on-chip or off-chip clock signal. Power control: Programmable PMU (Power Management Unit) to minimize power consumption and to match requirements at different performance levels. Reduced power modes: sleep, deep-sleep, and deep power-down.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 3. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC54018JET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC54018JBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC54016JET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 3.1 Ordering options Flexcomm Interface EMC data bus width (bit) yes yes yes yes yes 8/16 11 145 yes yes yes yes yes yes yes 8/16/32 11 171 yes FS USB SHA yes 360 GPIO 360 LQFP208 LCD CAN FD TFBGA180 LPC54018JBD208 HS USB LPC54018JET180 SRAM/kB Classic CAN Ethernet AVB Package Name Ordering options Type number Table 2. LPC54018 devices (HS/FS USB, Ethernet, CAN 2.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 4. Marking Terminal 1 index area n Terminal 1 index area aaa-025721 Fig 1. TFBGA180 and TFBGA 100 package markings Fig 2. 1 aaa-011231 LQFP208 package marking n Terminal 1 index area Fig 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 3. Device revision table Revision identifier (R) Revision description 0A Initial device revision with Boot ROM version 21.0 LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V. 2018. All rights reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 5. Block diagram Figure 4 shows the LPC540xx block diagram. In this figure, orange shaded blocks support general purpose DMA and yellow shaded blocks include dedicated DMA control. LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V. 2018. All rights reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller JTAG test and ISP access boundary scan interface port DEBUG INTERFACE ARM CORTEX-M4 WITH FPU/MPU I-code bus ethernet PHY interface LCD panel FS USB bus SDIO interface ETHERNET 10/100 MAC +AVB LCD PANEL INTERFACE USB 2.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 6. Pinning information 6.1 Pinning ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H J K L M N P aaa-026026 Transparent top view Fig 5. TFBGA 180 Pin configuration ball A1 index area 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K aaa-029079 Transparent top view Fig 6. LPC540xx Product data sheet TFBGA 100 Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 1.
LPC540xx NXP Semiconductors 157 208 32-bit ARM Cortex-M4 microcontroller 156 52 105 53 104 1 aaa-026027 Fig 7. LQFP 208 Pin configuration 75 25 51 LPC540xx Product data sheet 50 26 Fig 8. 76 100 1 aaa-029081 LQFP 100 Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V. 2018. All rights reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 6.2 Pin description On the LPC540xx, digital pins are grouped into several ports. Each digital pin can support several different digital functions (including General Purpose I/O (GPIO)) and an additional analog function. 100-pin, LQFP C4 D6 196 93 [2] Description Type 208-pin, LQFP PIO0_0 Reset state[1] [9] Symbol 180-pin, TFBGA Pin description 100-pin, TFBGA Table 4.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 85 [2] Description Type A10 178 Reset state[1] [9] A6 100-pin, LQFP PIO0_3/ TCK 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_3 — General-purpose digital input/output pin. In boundary scan mode: TCK (Test Clock In). Remark: In ISP mode, this pin is set to the Flexcomm 3 SPI MOSI function.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP A4 A5 191 90 [2] Description Type 208-pin, LQFP PIO0_6/ TDO Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_6 — General-purpose digital input/output pin. In boundary scan mode: TDO (Test Data Out). Remark: The state of this pin at Reset in conjunction with PIO0_4 and PIO0_5 will determine the boot source for the part or if ISP handler is invoked.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 65 [2] Description Type 100-pin, LQFP 208-pin, LQFP E10 G12 136 180-pin, TFBGA PIO0_9 Reset state[1] [9] Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_9 — General-purpose digital input/output pin. I/O FC3_SSEL2 — Flexcomm 3: SPI slave select 2. O SD_POW_EN — SD/MMC card power enable. I/O FC5_TXD_SCL_MISO — Flexcomm 5: USART transmitter, I2C clock, SPI master-in/slave-out data. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP J2 M3 52 25 [4] Description Type 208-pin, LQFP PIO0_12/ ADC0_2 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O; PIO0_12/ADC0_2 — General-purpose digital input/output AI pin. ADC input channel 2 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC3_TXD_SCL_MISO — Flexcomm 3: USART transmitter, I2C clock, SPI master-in/slave-out data.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP K2 L4 53 26 [4] Description Type 208-pin, LQFP PIO0_15/ ADC0_3 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O; PIO0_15/ADC0_3 — General-purpose digital input/output AI pin. ADC input channel 3 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. I/O FC6_CTS_SDA_SSEL0 — Flexcomm 6: USART clear-to-send, I2C data I/O, SPI Slave Select 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 72 [2] Description Type C14 150 Reset state[1] [9] C9 100-pin, LQFP PIO0_18 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_18 — General-purpose digital input/output pin. I/O FC4_CTS_SDA_SSEL0 — Flexcomm 4: USART clear-to-send, I2C data I/O, SPI Slave Select 0. PIO0_19 C5 C6 193 91 [2] I SD_WR_PRT — SD/MMC write protect. O CT1_MAT0 — Match output 0 from Timer 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 80 [2][8] Description Type B12 163 Reset state[1] [9] B8 100-pin, LQFP PIO0_22 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_22 — General-purpose digital input/output pin. I/O FC6_TXD_SCL_MISO_WS — Flexcomm 6: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame. I UTICK_CAP1 — Micro-tick timer capture input 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 56 [2] Description Type 100-pin, LQFP 208-pin, LQFP H10 M13 110 180-pin, TFBGA PIO0_26 Reset state[1] [9] Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_26 — General-purpose digital input/output pin. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data. O CLKOUT — Output of the CLKOUT function. I CT3_CAP2 — Capture input 2 to Timer 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 82 [2] Description Type B13 167 Reset state[1] [9] B7 100-pin, LQFP PIO0_29 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO0_29 — General-purpose digital input/output pin. Remark: In ISP mode, this pin is set to the Flexcomm 0 USART RXD function. I/O FC0_RXD_SDA_MOSI — Flexcomm 0: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 55 [2] Description Type 100-pin, LQFP 208-pin, LQFP J10 K12 109 180-pin, TFBGA PIO1_1 Reset state[1] [9] Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_1/ — General-purpose digital input/output pin. I/O FC3_RXD_SDA_MOSI — Flexcomm 3: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved. I CT0_CAP3 — Capture 3 input to Timer 0. I SCT0_GPI5 — Pin input 5 to SCTimer/PWM.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP C3 D4 3 3 [2] Description Type 208-pin, LQFP PIO1_4 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_4 — General-purpose digital input/output pin. I/O FC0_SCK — Flexcomm 0: USART or SPI clock. I/O SD_D[0] — SD/MMC data 0. O CT2_MAT1 — Match output 1 from Timer 2. O SCT0_OUT0 — SCTimer/PWM output 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP H5 P8 72 36 [2] Description Type 208-pin, LQFP PIO1_8 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_8 — General-purpose digital input/output pin. I/O FC0_CTS_SDA_SSEL0 — Flexcomm 0: USART clear-to-send, I2C data I/O, SPI Slave Select 0. O SD_CLK — SD/MMC clock. R — Reserved. O SCT0_OUT1 — SCTimer/PWM output 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP F8 K9 128 62 [2] Description Type 208-pin, LQFP PIO1_12 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_12 — General-purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0. I/O FC6_SCK — Flexcomm 6: USART, SPI, or I2S clock. PIO1_13 D10 G10 139 66 [2] O CT1_MAT1 — Match output 1 from Timer 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP B5 B7 187 88 [2] Description Type 208-pin, LQFP PIO1_16 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_16 — General-purpose digital input/output pin. O ENET_MDC — Ethernet management data clock. I/O FC6_TXD_SCL_MISO_WS — Flexcomm 6: USART transmitter, I2C clock, SPI master-in/slave-out data I/O, I2S word-select/frame.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP G2 M1 35 17 [2] Description Type 208-pin, LQFP PIO1_20 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_20 — General-purpose digital input/output pin. I/O FC7_RTS_SCL_SSEL1 — Flexcomm 7: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. I CT3_CAP2 — Capture 2 input to Timer 3. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 57 [2] Description Type N14 111 Reset state[1] [9] G8 100-pin, LQFP PIO1_24 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_24 — General-purpose digital input/output pin. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data. O SCT0_OUT1 — SCTimer/PWM output 1. R — Reserved. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 73 [2] Description Type 100-pin, LQFP 208-pin, LQFP A10 E12 151 180-pin, TFBGA PIO1_28 Reset state[1] [9] Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO1_28 — General-purpose digital input/output pin. I/O FC7_SCK — Flexcomm 7: USART, SPI, or I2S clock. I/O SD_D[5] — SD/MMC data 5. I CT0_CAP2 — Capture 2 input to Timer 0. R — Reserved. R — Reserved. I/O EMC_D[12] — External Memory interface data [12].
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - P3 57 - [4] Description Type 208-pin, LQFP PIO2_0/ ADC0_7 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O; PIO2_0/ADC0_7 — General-purpose digital input/output AI pin. ADC input channel 7 if the DIGIMODE bit is set to 0 in the IOCON register for this pin. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - C1 12 - [2] Description Type 208-pin, LQFP PIO2_5 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO2_5 — General-purpose digital input/output pin. O ENET_TX_ER — Ethernet Transmit Error (MII interface). O SD_POW_EN — SD/MMC card power enable I/O FC1_CTS_SDA_SSEL0 — Flexcomm 1: USART clear-to-send, I2C data I/O, SPI Slave Select 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - M2 45 - [2] Description Type 208-pin, LQFP PIO2_12 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO2_12 — General-purpose digital input/output pin. O LCD_LE — LCD line end signal. O SD_VOLT[1] — SD/MMC card regulator voltage control [1].
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - L8 81 - [2][8] Description Type 208-pin, LQFP PIO2_16 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO2_16 — General-purpose digital input/output pin. O LCD_LP — LCD line synchronization pulse (STN). Horizontal synchronization pulse (TFT). O USB1_FRAME — USB1 frame toggle signal.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - L10 99 - [2] Description Type 208-pin, LQFP PIO2_21 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO2_21 — General-purpose digital input/output pin. O LCD_VD[3] — LCD Data [3]. I/O FC3_CTS_SDA_SSEL0 — Flexcomm 3: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O MCLK — MCLK input or output for I2S and/or digital microphone.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2] Description Type H14 130 Reset state[1] [9] - 100-pin, LQFP PIO2_27 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO2_27 — General-purpose digital input/output pin. O LCD_VD[9] — LCD Data [9]. I/O FC9_SCK — Flexcomm 9: USART or SPI clock. I/O FC3_SSEL2 — Flexcomm 3: SPI slave select 2.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2] Description Type C10 164 Reset state[1] [9] - 100-pin, LQFP PIO3_2 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO3_2 — General-purpose digital input/output pin. O LCD_VD[16] — LCD Data [16]. I/O FC9_RXD_SDA_MOSI — Flexcomm 9: USART receiver, I2C data I/O, SPI master-out/slave-in data. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - C7 192 - [2] Description Type 208-pin, LQFP PIO3_9 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO3_9 — General-purpose digital input/output pin. O LCD_VD[23] — LCD Data [23]. O LCD_VD[3] — LCD Data [3]. R — Reserved. I PIO3_10 - A3 199 - [2] CT0_CAP2 — Capture input 2 to Timer 0. PU; Z I/O PIO3_10 — General-purpose digital input/output pin.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - H4 75 - [2] Description Type 208-pin, LQFP PIO3_13 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO3_13 — General-purpose digital input/output pin. O SCT0_OUT9 — SCTimer/PWM output 9. I/O FC9_CTS_SDA_SSEL0 — Flexcomm 9: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I CT3_CAP1 — Capture input 1 to Timer 3. R — Reserved. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - J3 44 - [2] Description Type 208-pin, LQFP PIO3_19 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO3_19 — General-purpose digital input/output pin. I/O FC8_RTS_SCL_SSEL1 — Flexcomm 8: USART request-to-send, I2C clock, SPI slave select 1. I/O SD_D[7] — SD/MMC data 7. PIO3_20 - N2 46 - [2] O CT4_MAT1 — Match output 1 from Timer 4.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - P9 82 - [2] Description Type 208-pin, LQFP PIO3_25 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO3_25 — General-purpose digital input/output pin. R — Reserved. I CT4_CAP2 — Capture input 2 to Timer 4. I/O FC4_SCK — Flexcomm 4: USART or SPI clock. R — Reserved. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - L13 112 - [2] Description Type 208-pin, LQFP PIO3_29 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO3_29 — General-purpose digital input/output pin. R — Reserved. O SCT0_OUT3 — SCTimer/PWM output 3. I/O FC4_RTS_SCL_SSEL1 — Flexcomm 4: USART request-to-send, I2C clock, SPI slave select 1. R — Reserved. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2] Description Type G14 132 Reset state[1] [9] - 100-pin, LQFP PIO4_1 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_1 — General-purpose digital input/output pin. R — Reserved. I/O FC6_SCK — Flexcomm 6: USART, SPI, or I2S clock. R — Reserved. R — Reserved. PIO4_2 - F14 138 - [2] I SCT0_GPI2 — Pin input 2 to SCTimer/PWM.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2] Description Type E10 154 Reset state[1] [9] - 100-pin, LQFP PIO4_5 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_5 — General-purpose digital input/output pin. R — Reserved. I/O FC9_CTS_SDA_SSEL0 — Flexcomm 9: USART clear-to-send, I2C data I/O, SPI Slave Select 0. I/O FC0_CTS_SDA_SSEL0 — Flexcomm 0: USART clear-to-send, I2C data I/O, SPI Slave Select 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller - [2][8] Description Type A12 173 Reset state[1] [9] - 100-pin, LQFP PIO4_9 208-pin, LQFP 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_9 — General-purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1. I/O FC2_RXD_SDA_MOSI — Flexcomm 2: USART receiver, I2C data I/O, SPI master-out/slave-in data.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - B5 194 - [2] Description Type 208-pin, LQFP PIO4_14 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_14 — General-purpose digital input/output pin. I ENET_RX_CLK — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). O CT4_MAT1 — Match output 1 from Timer 4. I/O FC9_SCK — Flexcomm 9: USART or SPI clock. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 14 - [2] Description Type 208-pin, LQFP PIO4_19 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_19 — General-purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0. O SD_CLK — SD/MMC clock. I/O FC2_SCK — Flexcomm 2: USART or SPI clock. I CT4_CAP2 — Capture input 2 to Timer 4.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 42 - [2] Description Type 208-pin, LQFP PIO4_23 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_23 — General-purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0. I SD_WR_PRT — SD/MMC write protect. I/O FC2_CTS_SDA_SSEL0 — Flexcomm 2: USART clear-to-send, I2C data I/O, SPI Slave Select 0. R — Reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 85 - [2] Description Type 208-pin, LQFP PIO4_27 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_27 — General-purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). I/O SD_D[2] — SD/MMC data 2. R — Reserved. I/O FC1_SCK — Flexcomm 1: USART or SPI clock. I CT1_CAP0 — Capture input 0 to Timer 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 114 - [2] Description Type 208-pin, LQFP PIO4_31 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO4_31 — General-purpose digital input/output pin. I ENET_RX_CLK — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). I/O SD_D[6] — SD/MMC data 6. O CT3_MAT1 — Match output 1 from Timer 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 129 - [2] Description Type 208-pin, LQFP PIO5_3 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO5_3 — General-purpose digital input/output pin. O ENET_MDC — Ethernet management data clock. O SD_VOLT[2] — SD/MMC card regulator voltage control [2]. I CT3_CAP1 — Capture input 1 to Timer 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP - - 171 - [2] Description Type 208-pin, LQFP PIO5_7 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. PU; Z I/O PIO5_7 — General-purpose digital input/output pin. I SCT0_GPI2 — Pin input 2 to SCTimer/PWM. I/O MCLK — MCLK input or output for I2S and/or digital microphone. I/O FC5_RXD_SDA_MOSI — Flexcomm 5: USART receiver, I2C data I/O, SPI master-out/slave-in data.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 100-pin, LQFP E1 G3 24 10 Description Type 208-pin, LQFP USB1_AVDDC3V3 Reset state[1] [9] 180-pin, TFBGA Pin description …continued Symbol 100-pin, TFBGA Table 4. USB1 analog 3.3 V supply. USB1_AVDDTX3V3 E2 H1 25 11 USB1_DP F2 H3 27 13 [6] I/O USB1 bidirectional D+ line. USB1 analog 3.3 V supply for line drivers. USB1_DM E3 H2 26 12 [6] I/O USB1 bidirectional D- line.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller [1] PU = input mode, pull-up enabled (pull-up resistor pulls up pin to VDD). Z = high impedance; pull-up or pull-down disabled, AI = analog input, I = input, O = output, F = floating. Reset state reflects the pin state at reset without boot code operation. For pin states in the different power modes, see Section 6.2.2 “Pin states in different power modes”. For termination on unused pins, see Section 6.2.1 “Termination of unused pins”.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 5. Termination of unused pins Pin Default Recommended termination of unused pins state[1][2] VBAT - Tie to VDD. USBn_DP F Can be left unconnected. If USB interface is not used, pin can be left unconnected except in deep power-down mode where it must be externally pulled low. When the USB PHY is disabled, the pins are floating. USBn_DM F Can be left unconnected.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7. Functional description 7.1 Architectural overview The ARM Cortex-M4 includes three AHB-Lite buses: the system bus, the I-code bus, and the D-code bus. The I-code and D-code core buses allow for concurrent code and data accesses from different slave ports.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.5 Nested Vectored Interrupt Controller (NVIC) for Cortex-M4 The NVIC is an integral part of the Cortex-M4. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.5.1 Features • • • • • • Controls system exceptions and peripheral interrupts. Supports up to 54 vectored interrupts. Eight programmable interrupt priority levels, with hardware priority level masking.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.9 Memory mapping The LPC540xx incorporates several distinct memory regions. The APB peripheral area is 512 kB in size and is divided to allow for up to 32 peripherals.Each peripheral is allocated 4 kB of space simplifying the address decoding. The registers incorporated into the CPU, such as NVIC, SysTick, and sleep mode control, are located on the private peripheral bus. The ARM Cortex-M4 processor has a single 4 GB address space.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 7. Memory usage and details …continued Address range General Use Address range details and description 0x8000 0000 to 0xDFFF FFFF Off-chip Memory Four static memory chip selects: via the External 0x8000 0000 - 0x83FF FFFF Static memory chip select 0 (up to 64 Memory MB)[1] Controller 0x8800 0000 - 0x8BFF FFFF Static memory chip select 1 (up to 64 MB)[2] 0x9000 0000 – 0x93FF FFFF Static memory chip select 2 (up to 64 MB).
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Memory space AHB peripherals 0xFFFF FFFF (reserved) private peripheral bus 0xE010 0000 (reserved) 0xE000 0000 (EMC) (reserved) USB SRAM (8 kB) 0x8000 0000 (reserved) 0x4400 0000 SHA registers peripheral bit-band addressing (reserved) HS USB host registers 0x4200 0000 FS USB host registers 0x4010 C000 (reserved) AHB peripheral (reserved) Asynchronous APB peripherals ADC 0x4008 0000 Flexcomm 10 0x4006 0000 CAN 1 CAN 0 0x4
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller APB bridge 1 APB bridge 0 (reserved) 31-22 21 OTP controller 20-15 (reserved) 14 Micro-Tick 13 MRT 12 WDT 11-10 (reserved) 9 CTIMER1 31-28 (reserved) 0x4001 FFFF 27 (reserved) 0x4001 6000 26 25-24 RNG (reserved) 23 22 21-14 Smart card 1 Smart card 0 (reserved) 0x4001 5000 0x4001 F000 0x4000 E000 0x4000 D000 8 CTIMER0 7-6 (reserved) 5 Input muxes 4 Pin Interrupts (PINT) 3 GINT1 2 GINT0 1 IOCON 0 Sysco
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.10.1.3 Crystal oscillator The LPC540xx include four independent oscillators. These are the main oscillator, the FRO, the watchdog oscillator, and the RTC oscillator. Following reset, the LPC540xx will operate from the Internal FRO until switched by software. This allows systems to operate without any external crystal and the boot loader code to operate at a known frequency.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.10.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller (1 per Flexcomm) main_clk pll_clk fro_12m 000 001 fro_hf “none” 011 fro_12m fro_hf_div audio_pll_clk 010 111 mclk_in frg_clk “none” FRG CLOCK DIVIDER FRG clock select FRGCTRL[15:0] FRGCLKSEL[2:0] 000 001 fcn_fclk (function clock of Flexcomm[0-9]) 010 011 (up to 11 Flexcomm 100 Interfaces on these devices) 111 main_clk FCLKSEL[0-9] to CLK32K of all Flexcomms (fc0-fc9) 32k_clk CAN0CLKDIV main_clk main_clk 000 001 fcn_fclk (fu
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.10.6 Brownout detection The LPC540xx includes a monitor for the voltage level on the VDD pin. If this voltage falls below a fixed level, the BOD sets a flag that can be polled or cause an interrupt. In addition, a separate threshold level can be selected to cause chip reset. 7.10.7 Safety The LPC540xx includes a Windowed WatchDog Timer (WWDT), which can be enabled by software after reset.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 8 shows the peripheral configuration in reduced power modes. Table 8.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 9 shows wake-up sources for reduced power modes. Table 9. Wake-up sources for reduced power modes Power mode Wake-up source Conditions Sleep Any interrupt Enable interrupt in NVIC. HWWAKE Certain Flexcomm Interface and DMIC subsystem activity. Pin interrupts Enable pin interrupts in NVIC and STARTER0 and/or STARTER1 registers.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 9. Wake-up sources for reduced power modes Power mode Wake-up source Deep power-down RTC 1 Hz alarm timer RTC 1 kHz timer time-out and alarm Reset pin Conditions • • • Enable the RTC 1 Hz oscillator in the RTC CTRL register. • • Enable the RTC bus clock in the AHBCLKCTRL0 register. Start RTC alarm timer by writing a time-out value to the RTC COUNT register.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.13.1 Features • Pin interrupts: – Up to eight pins can be selected from all GPIO pins on ports 0 and 1 as edge-sensitive or level-sensitive interrupt requests. Each request creates a separate interrupt in the NVIC. – Edge-sensitive interrupt pins can interrupt on rising or falling edges or both. – Level-sensitive interrupt pins can be HIGH-active or LOW-active. – Level-sensitive interrupt pins can be HIGH-active or LOW-active.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.14.1.2 USB0 host controller The host controller enables full- and low-speed data exchange with USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies with the Open Host Controller Interface (OHCI) specification. Features • OHCI compliant. • Two downstream ports. 7.14.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.14.3 Ethernet AVB The Ethernet block enables a host to transmit and receive data over Ethernet in compliance with the IEEE 802.3-2008 standard. The Ethernet interface contains a full featured 10 Mbps or 100 Mbps Ethernet MAC (Media Access Controller) designed to provide optimized performance through the use of DMA hardware acceleration. 7.14.3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller • Supports DMA access. • Provides XIP (execute in place) feature to execute code directly from serial flash. 7.14.5 CAN Flexible Data (CAN FD) interface The LPC540xx contains two CAN FD interfaces, CAN FD 1 and CAN FD 2. 7.14.5.1 Features • • • • • • Conforms with CAN protocol version 2.0 part A, B and ISO 11898-1. CAN FD with up to 64 data bytes supported. CAN Error Logging. AUTOSAR support. SAE J1939 support.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.14.8.2 SPI serial I/O controller Features • Maximum data rates of 48 Mbit/s in master mode and 14 Mbit/s in slave mode for SPI functions. (Flexcomm Interface 0-9). • Maximum data rates of 50 Mbit/s in master mode and 50 Mbit/s in slave mode for SPI functions (Flexcomm Interface10). • Data frames of 1 to 16 bits supported directly. Larger frames supported by software or DMA set-up. • Master and slave operation.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.14.8.4 USART Features • Maximum bit rates of 6.25 Mbit/s in asynchronous mode. • The maximum supported bit rate for USART master synchronous mode is 24 Mbit/s, and the maximum supported bit rate for USART slave synchronous mode is 12.5 Mbit/s. • 7, 8, or 9 data bits and 1 or 2 stop bits. • Synchronous mode with master or slave operation. Includes data phase selection and continuous clock option.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller signals, and are configured together for either transmit or receive operation, using the same mode, same data configuration and frame configuration. All such channel pairs can participate in a time division multiplexing (TDM) arrangement. For cases requiring an MCLK input and/or output, this is handled outside of the I2S block in the system level clocking scheme.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller • Setup and control via a separate AHB slave interface. • Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. • Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller • Asynchronous static memory device support including RAM, ROM, and flash, with or without asynchronous page mode. • 8/16/32 data and 16/20/26 address lines wide static memory support. • Static memory features include: – Asynchronous page mode read. – Programmable Wait States. – Bus turnaround delay. – Output enable and write enable delays. – Extended wait. • Dynamic memory interface support including single data rate SDRAM.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.15.4 DMA controller The DMA controller allows peripheral-to memory, memory-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional DMA transfers for a single source and destination. 7.15.4.1 Features • One channel per on-chip peripheral direction: typically one for input and one for output for most peripherals. • • • • • • • DMA operations can optionally be triggered by on- or off-chip events.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. • The timer and prescaler may be configured to be cleared on a designated capture event. This feature permits easy pulse width measurement by clearing the timer on the leading edge of an input pulse and capturing the timer value on the trailing edge.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller – 8 inputs – 10 outputs – 16 match/capture registers – 16 events – 16 states • PWM capabilities including dead time and emergency abort functions 7.16.3 Windowed WatchDog Timer (WWDT) The purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.16.3.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.16.6 Repetitive Interrupt Timer (RIT) The repetitive interrupt timer provides a free-running 48-bit counter which is compared to a selectable value, generating an interrupt when a match occurs. Any bits of the timer/compare can be masked such that they do not contribute to the match detection. The repetitive interrupt timer can be used to create an interrupt that repeats at predetermined intervals. 7.16.6.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.18 CRC engine The Cyclic Redundancy Check (CRC) generator with programmable polynomial settings supports several CRC standards commonly used. To save system power and bus bandwidth, the CRC engine supports DMA transfers. 7.18.1 Features • Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.20.1.1 Features • Secure Hash Algorithm (SHA1/SHA2) module with dedicated DMA controller. • Used with an HMAC to support a challenge/response or to validate a message. • Can be used to verify external memory that has not been compromised. 7.21 Emulation and debugging Debug and trace functions are integrated into the ARM Cortex-M4. Serial wire debug and trace functions are supported.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 8. Limiting values Table 10. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions [2] Min Max Unit -0.5 +4.6 V VDD supply voltage (core and on pin VDD external rail) VDDA analog supply voltage on pin VDDA -0.5 +4.6 V VBAT battery supply voltage on pin VBAT -0.5 +4.6 V Vref reference voltage on pin VREFP VI input voltage only valid when the VDD > 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 10. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Ptot(pack) VESD [1] Parameter Conditions total power dissipation (per package) electrostatic discharge voltage Min Max Unit LQFP208, based on package heat transfer, not device power consumption [11] - 1.2 W LQFP208, based on package heat transfer, not device power consumption [12] - 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller [9] It is recommended to connect an overvoltage protection diode between the analog input pin and the voltage supply pin. [10] Dependent on package type. [11] JEDEC (4.5 in 4 in); still air. [12] Single layer (4.5 in 3 in); still air. [13] 8-layer (4.5 in 3 in); still air. LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: T j = T amb + P D R th j – a (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 10. Static characteristics 10.1 General operating conditions Table 12. General operating conditions Tamb = 40 C to +105 C, unless otherwise specified. Symbol Parameter Conditions fclk CPU clock frequency Typ[1] Max Unit - - 180 MHz CPU clock frequency For USB high-speed device and host operations 60 - 180 MHz CPU clock frequency For USB full-speed device and host operations 12 - 180 MHz 1.71 - 3.6 V 2.7 - 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller DDD &RUHPDUN VFRUH LWHUDWLRQV V 0+] 0 65$0 )UHTXHQF\ 0+] Conditions: VDD = 3.3 V; Tamb = 25 °C; active mode; all peripherals disabled; BOD disabled; Measured with IAR ver 8.22.2. Optimization level 3, optimized for time ON. 12 MHz, 24 MHz, 48 MHz, and 96 MHz: FRO enabled; PLL disabled.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 10.3 Power consumption Power measurements in Active, sleep, and deep-sleep modes were performed under the following conditions: • • • • Configure all pins as GPIO with pull-up resistor disabled in the IOCON block. Configure GPIO pins as outputs using the GPIO DIR register. Write 1 to the GPIO CLR register to drive the outputs LOW. All peripherals disabled. Table 14.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller DDD $ 0+] 0 65$0 )52 3// 0 65$0 )52 )UHTXHQF\ 0+] Conditions: VDD = 3.3 V; Tamb = 25 °C; active mode; all peripherals disabled; BOD disabled; Measured with Keil uVision v.5.23. Optimization level 0, optimized for time off. 12 MHz, 24 MHz, 48 MHz, and 96 MHz: FRO enabled; PLL disabled.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 16. Static characteristics: Power consumption in deep-sleep and deep power-down modes Tamb = 40 C to +105 C, unless otherwise specified, 2.2 V VDD 3.6 V. Symbol Parameter Conditions IDD supply current Deep-sleep mode: SRAMX (64 KB) powered Min Typ[1][2] Max[3] Unit - 55 175 A - - 2020 A - 891 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller DDD ,'' $ 9 9 9 9 7HPSHUDWXUH & Conditions: BOD disabled; all oscillators and analog blocks disabled; all SRAM disabled except 64 KB SRAMX. Remark: At hot temperature and below 2.0 V, the supply current increases slightly because of reduction of available RBB (reverse body bias) voltage. Fig 15.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller registers. All other blocks are disabled and no code accessing the peripheral is executed. The supply currents are shown for system clock frequencies of 12 MHz, 48 MHz, 96 MHz and 180MHz. Table 18. Typical peripheral power consumption[1][2] VDD = 3.3 V; Tamb = 25 °C Peripheral IDD in uA FRO 100 WDT OSC 2.0 BOD 2.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 19. Typical AHB/APB peripheral power consumption [3][4][5] Tamb = 25 °C, VDD = 3.3 V; Peripheral IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz Flexcomm Interface 3 (USART, SPI, I2C) 1.4 1.4 1.4 1.6 Flexcomm Interface 4 (USART, SPI, I2C) 1.4 1.5 1.5 1.7 Flexcomm Interface 5 (USART, SPI, I2C) 1.7 1.7 1.7 1.9 Flexcomm Interface 6 (USART, SPI, I2C, I2S) 2.0 2.0 2.0 2.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 19. Typical AHB/APB peripheral power consumption [3][4][5] Tamb = 25 °C, VDD = 3.3 V; Peripheral IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz IDD in uA/MHz Async APB peripheral CPU: 12 MHz, CPU: 48 MHz, sync CPU: 96 MHz, CPU: 180 MHz, Async APB bus: 12 APB bus: 12 MHz[2] Async APB bus: 12 Async APB bus: MHz MHz[2] 12 MHz[2] Timer3 0.9 0.9 0.9 0.9 Timer4 0.9 0.9 0.9 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 20. Static characteristics: pin characteristics …continued Tamb = 40 C to +105 C, unless otherwise specified. 1.71 V VDD 3.6 V unless otherwise specified. Values tested in production unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/pull-down resistors disabled - 3 180 nA VOH HIGH-level output voltage IOH = 4 mA; 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 20. Static characteristics: pin characteristics …continued Tamb = 40 C to +105 C, unless otherwise specified. 1.71 V VDD 3.6 V unless otherwise specified. Values tested in production unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit USB0_DM and USB0_DP pins VI input voltage 0 - VDD V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller VDD IOL Ipd + - pin PIO0_n A IOH Ipu - + pin PIO0_n A aaa-010819 Fig 17. Pin input/output current measurement 10.4.1 Electrical pin characteristics DDD & & & & ,2/ P$ DDD ,2/ P$ & & & & 92/ 9 Conditions: VDD = 1.8 V; on pins PIO0_13 to PIO0_14. Fig 18.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller DDD ,2/ P$ DDD & & & & ,2/ P$ & & & & 92/ 9 Conditions: VDD = 1.8 V; on standard port pins. 92/ 9 Conditions: VDD = 3.3 V; on standard port pins. Fig 19.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller DDD ,SX $ DDD ,SX $ & & & & & & & & 9, 9 Conditions: VDD = 1.8 V; on standard port pins. 9, 9 Conditions: VDD = 3.3 V; on standard port pins. Fig 21.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11. Dynamic characteristics 11.1 I/O pins Table 21. Dynamic characteristic: I/O pins[1] Tamb = 40 C to +105 C; 1.71 V VDD 3.6 V Symbol Parameter Conditions Min Typ Max Unit 1.0 - 2.5 ns 1.6 - 3.8 ns 0.9 - 2.5 ns 1.7 - 4.1 ns 1.9 - 4.3 ns 2.9 - 7.8 ns Standard I/O pins - normal drive strength tr rise time pin configured as output; SLEW = 1 (Fast-mode); [2][3] 2.7 V VDD <= 3.6 V 1.71 V VDD <= 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.2 Wake-up process Table 22. Dynamic characteristic: Typical wake-up times from low power modes VDD = 3.3 V;Tamb = 25 C; using FRO as the system clock. Symbol Parameter twake wake-up time Min Typ[1] from sleep mode [2][3] - 2.0 - s from deep-sleep mode; SRAMx powered. [2][5] - 150 - s [4][5] - 1.2 - ms Conditions Max Unit SRAM0, SRAM1, SRAM2, SRAM3, and USB SRAM powered down.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.3 External memory interface Table 23. Dynamic characteristics: Static external memory interface CL = 10 pF balanced loading on all pins, Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V. Max EMC clock = 100 MHz. Input slew = 1 ns; SLEW set to fast-mode. Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Excluding delays introduced by external device and PCB; Values based on simulation.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 23. Dynamic characteristics: Static external memory interface …continued CL = 10 pF balanced loading on all pins, Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V. Max EMC clock = 100 MHz. Input slew = 1 ns; SLEW set to fast-mode. Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Excluding delays introduced by external device and PCB; Values based on simulation.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 24. Dynamic characteristics: Static external memory interface …continued CL = 20 pF balanced loading on all pins, Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V. Max EMC clock = 100 MHz. Input slew = 1 ns; SLEW set to fast-mode. Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Excluding delays introduced by external device and PCB; Values based on simulation.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller [2] Tcy(clk) = 1/EMC_CLK (see UM11060 LPC540xx manual). [3] Latest of address valid, EMC_CSx LOW, EMC_OE LOW, EMC_BLSx LOW (PB = 1). [4] After End Of Read (EOR): Earliest of EMC_CSx HIGH, EMC_OE HIGH, EMC_BLSx HIGH (PB = 1), address invalid. [5] End Of Write (EOW): Earliest of address invalid, EMC_CSx HIGH, EMC_BLSx HIGH (PB = 1).
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller EMC_Ax RD1 WR1 EMC_CSx RD2 WR8 RD8 RD4 EMC_OE RD3 RD7 WR4 EMC_BLSx WR8 RD7 WR3 WR5 WR7 EMC_WE RD5a RD5b RD5c RD6 RD5 WR2 WR6 EMC_Dx EOR EOW aaa026104 Fig 24. External static memory read/write access (PB =1) EMC_Ax EMC_CSx EMC_OE EMC_BLSx EMC_WE RD5 RD5 RD5 RD5 EMC_Dx 002aag216 Fig 25.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 25. Dynamic characteristics: Dynamic external memory interface, read strategy bits (RD bits) = 01 [2] CL = 10 pF balanced loading on all pins, Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V. Max EMC clock = 100 MHz. Input slew = 1 ns; SLEW set to fast-mode. Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Excluding delays introduced by external device and PCB. Values based on simulation.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 26. Dynamic characteristics: Dynamic external memory interface, read strategy bits (RD bits) = 01 [2] CL = 20 pF balanced loading on all pins, Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V. Max EMC clock = 100 MHz. Input slew = 1 ns; SLEW set to fast-mode. Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Excluding delays introduced by external device and PCB. Values based on simulation.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) EMC_CLKOUT0 EMC_CLKOUT1 EMC_DYCSn, EMC_RAS, EMC_CAS, EMC_WE, EMC_CKEOUTn, EMC_A[22:0], EMC_DQMOUTn td(xV) th(x) td(QV) th(Q) EMC_D[31:0] write tsu(D) th(D) EMC_D[31:0] read aaa-024988 Fig 26. Dynamic external memory interface signal timing LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V. 2018. All rights reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 27. Dynamic characteristics: Dynamic external memory interface programmable clock delays (CMDDLY, FBCLKDLY) Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V.Values guaranteed by design. tcmddly is programmable delay value for EMC command outputs in command delayed mode; tfbdly is programmable delay value for the feedback clock that controls input data sampling.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.4 System PLL (PLL0) Table 28. PLL lock times and current Tamb = 40 C to +105 C, unless otherwise specified. VDD = 1.71 V to 3.6 V Symbol Parameter Conditions Min Typ Max Unit PLL0 configuration: input frequency 12 MHz; output frequency 100 MHz tlock(PLL0) IDD(PLL0) PLL0 lock time [1] PLL0 current [1][2] when locked - - 96 s 2.0 mA PLL0 configuration: input frequency 32 kHz; output frequency 100 MHz Table 29.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.5 USB PLL (PLL1) Table 30. PLL1 lock times and current Tamb = 40 C to +105 C, unless otherwise specified. VDD = 1.71 V to 3.6 V Symbol Parameter Conditions Min Typ Max Unit PLL1 configuration: input frequency 12 MHz; output frequency 48 MHz tlock(PLL1) IDD(PLL1) PLL1 lock time [1] - 7.4 - s PLL1 current [1][2] - 260 - A When locked [1] Data based on characterization results, not tested in production.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 33. Symbol Dynamic characteristics of the PLL2[1] Parameter Conditions Min Typ Max Unit 1 - 25 MHz 4.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 35. Dynamic characteristic: oscillator …continued Tamb = 40 C to +105 C; 1.71 V VDD 3.6 V.[1] Symbol Parameter Conditions High-frequency mode (20 - 25 tjit(per) period jitter time Min Typ[2] Max Unit - 4.3 - ps - 3.7 - ps MHz)[5] 20 MHz crystal [3] 25 MHz crystal [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.10 Watchdog oscillator Table 37. Dynamic characteristics: Watchdog oscillator Tamb = 40 C to +105 C; 1.71 VDD 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.11 I2C-bus Table 38. Dynamic characteristic: I2C-bus pins[1] Tamb = 40 C to +105 C; 1.71 V VDD 3.6 V.[2] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus 0 1 MHz Both SDA and SCL signals - 300 ns Fast-mode 20 + 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller tf SDA tSU;DAT 70 % 30 % 70 % 30 % tHD;DAT tf 70 % 30 % SCL tVD;DAT tHIGH 70 % 30 % 70 % 30 % 70 % 30 % tLOW S 1 / fSCL 002aaf425 Fig 27. I2C-bus pins clock timing LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V. 2018. All rights reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.12 I2S-bus interface Table 39. Dynamic characteristics: I2S-bus interface pins [1][4] Tamb = 40 C to 105 C; VDD = 1.71 V to 3.6 V; CL = 30 pF balanced loading on all pins; Input slew = 1.0 ns, SLEW setting = standard mode for all pins; Parameters sampled at the 50 % level of the rising or falling edge.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 39. Dynamic characteristics: I2S-bus interface pins [1][4] Tamb = 40 C to 105 C; VDD = 1.71 V to 3.6 V; CL = 30 pF balanced loading on all pins; Input slew = 1.0 ns, SLEW setting = standard mode for all pins; Parameters sampled at the 50 % level of the rising or falling edge. Symbol Parameter Min Typ[3] Max Unit CCLK 100 MHz 21.4 - 30.4 ns CCLK > 100 MHz 20.6 - 28.7 ns 21.1 - 29 ns 20.3 - 28.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) tf tr I2Sx_SCK tWH tWL I2Sx_TX_SDA tv(Q) I2Sx_RX_SDA tsu(D) th(D) I2Sx_WS aaa-026799 tv(Q) Fig 28. I2S-bus timing (master) Tcy(clk) tf tr I2Sx_SCK tWH tWL I2Sx_TX_SDA tv(Q) I2Sx_RX_SDA tsu(D) th(D) I2Sx_WS tsu(D) th(D) aaa-026800 Fig 29. I2S-bus timing (slave) LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.13 SPI interfaces (Flexcomm Interface 0-9) The actual SPI bit rate depends on the delays introduced by the external trace, the external device, system clock (CCLK), and capacitive loading. Excluding delays introduced by external device and PCB, the maximum supported bit rate for SPI master mode is 48 Mbit/s, and the maximum supported bit rate for SPI slave mode is 14 Mbit/s. Table 40.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) SCK (CPOL = 0) SCK (CPOL = 1) SSEL MOSI (CPHA = 0) tv(Q) tv(Q) DATA VALID (MSB) DATA VALID DATA VALID (MSB) MOSI (CPHA = 1) IDLE DATA VALID (MSB) DATA VALID (LSB) IDLE DATA VALID (MSB) tDH tDS MISO (CPHA = 0) DATA VALID (LSB) DATA VALID tv(Q) tv(Q) DATA VALID (LSB) DATA VALID tDS MISO (CPHA = 1) DATA VALID (LSB) DATA VALID (MSB) IDLE DATA VALID (MSB) DATA VALID (MSB) IDLE DATA VALID (MSB) tDH DATA VALI
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) SCK (CPOL = 0) SCK (CPOL = 1) SSEL MISO (CPHA = 0) tv(Q) tv(Q) DATA VALID (MSB) DATA VALID DATA VALID (MSB) MISO (CPHA = 1) IDLE DATA VALID (MSB) DATA VALID (LSB) IDLE DATA VALID (MSB) tDH tDS MOSI (CPHA = 0) DATA VALID (LSB) DATA VALID tv(Q) tv(Q) DATA VALID (LSB) DATA VALID tDS MOSI (CPHA = 1) DATA VALID (LSB) DATA VALID (MSB) IDLE DATA VALID (MSB) DATA VALID (MSB) IDLE DATA VALID (MSB) tDH DATA VALI
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.14 SPI interfaces (Flexcomm Interface 10) The actual SPI bit rate depends on the delays introduced by the external trace, the external device, system clock (CCLK), and capacitive loading. Excluding delays introduced by external device and PCB, the maximum supported bit rate for SPI master mode is 50 Mbit/s, and the maximum supported bit rate for SPI slave mode is 50 Mbit/s. Table 41.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) SCK (CPOL = 0) SCK (CPOL = 1) SSEL MOSI (CPHA = 0) tv(Q) tv(Q) DATA VALID (MSB) DATA VALID DATA VALID (MSB) MOSI (CPHA = 1) IDLE DATA VALID (MSB) DATA VALID (LSB) IDLE DATA VALID (MSB) tDH tDS MISO (CPHA = 0) DATA VALID (LSB) DATA VALID tv(Q) tv(Q) DATA VALID (LSB) DATA VALID tDS MISO (CPHA = 1) DATA VALID (LSB) DATA VALID (MSB) IDLE DATA VALID (MSB) DATA VALID (MSB) IDLE DATA VALID (MSB) tDH DATA VALI
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) SCK (CPOL = 0) SCK (CPOL = 1) SSEL MISO (CPHA = 0) tv(Q) tv(Q) DATA VALID (MSB) DATA VALID DATA VALID (MSB) MISO (CPHA = 1) IDLE DATA VALID (MSB) DATA VALID (LSB) IDLE DATA VALID (MSB) tDH tDS MOSI (CPHA = 0) DATA VALID (LSB) DATA VALID tv(Q) tv(Q) DATA VALID (LSB) DATA VALID tDS MOSI (CPHA = 1) DATA VALID (LSB) DATA VALID (MSB) IDLE DATA VALID (MSB) DATA VALID (MSB) IDLE DATA VALID (MSB) tDH DATA VALI
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.15 SPIFI The actual SPIFI bit rate depends on the delays introduced by the external trace, the external device, system clock (CCLK), and capacitive loading. Excluding delays introduced by external device and PCB, the maximum supported bit rate for SPIFI mode is 100 Mbit/s. Table 42. Dynamic characteristics: SPIFI[1] Tamb = 40 C to 105 C; VDD = 1.71 V to 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.16 DMIC subsystem Table 43. Dynamic characteristics[1] Tamb = 40 C to 105 C; VDD = 2.7 V to 3.6 V; CL = 30 pF balanced loading on all pins; Input slew = 1 ns, SLEW set to standard mode for all pins; Bypass bit = 0; Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Symbol Parameter Conditions Min Typ Max Unit tDS data set-up time CCLK 100 MHz 14.3 - - ns CCLK > 100 MHz 14.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.18 USART interface The actual USART bit rate depends on the delays introduced by the external trace, the external device, system clock (CCLK), and capacitive loading. Excluding delays introduced by external device and PCB, the maximum supported bit rate for USART master synchronous mode is 24 Mbit/s, and the maximum supported bit rate for USART slave synchronous mode is 12.5 Mbit/s. Table 45.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Tcy(clk) Un_SCLK (CLKPOL = 0) Un_SCLK (CLKPOL = 1) tv(Q) tvQ) START TXD BIT0 BIT1 tsu(D) th(D) START RXD BIT1 BIT0 aaa-015074 Fig 36. USART timing 11.19 SCTimer/PWM output timing Table 46. SCTimer/PWM output dynamic characteristics Tamb = 40 C to 105 C; 1.71 V VDD 3.6 V CL = 30 pF.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.21 TPERIOD crossover point extended crossover point differential data lines source EOP width: tFEOPT differential data to SE0/EOP skew n × TPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 37. Differential data-to-EOP transition skew and EOP width 11.22 Ethernet AVB Remark: The timing characteristics of the ENET_MDC and ENET_MDIO signals comply with the IEEE standard 802.3. Table 48.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 48. Dynamic characteristics: Ethernet Tamb = 40 C to 105 C, VDD = 2.7 V to 3.6 V. CL = 30 pF balanced loading on all pins; Input slew = 1 ns, SLEW setting = standard mode for all pins; Parameters sampled at the 90 % and 10 % level of the rising or falling edge. Based on simulation. Symbol th Parameter Conditions Min Typ Max Unit 1.2 - 0 ns 1.2 - 0 ns CCLK 100 MHz 10.0 - 18.2 ns CCLK > 100 MHz 10.0 - 18.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.23 SD/MMC and SDIO Table 49. Dynamic characteristics: SD/MMC and SDIO Tamb = 40 C to +105 C, VDD = 2.7 V to 3.6 V; CL = 20 pF. SAMPLE_DELAY = 0, DRV_DELAY = 0 in the SDDELAY register, SDIOCLKCTRL = 0x84, sampled at 90 % and 10 % of the signal level, SLEW = 1 ns for SD_CLK pin, SLEW = 1 ns for SD_DATn and SD_CMD pins. Simulated values in high-speed mode.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 11.24 LCD Table 50. Dynamic characteristics: LCD Tamb = 40 C to 105 C; VDD = 2.7 V to 3.6 V; CL = 30 pF. Simulated values. Symbol Parameter Conditions Min Typ Max Unit fclk clock frequency on pin LCD_DCLK - - 50 MHz tv(Q) data output valid time on all LCD output pins CCLK 100 MHz 0.9 - 1.6 ns CCLK > 100 MHz 0.9 - 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 12. Analog characteristics 12.1 BOD Table 51. BOD static characteristics Tamb = 25 C; based on characterization; not tested in production. Symbol Parameter Conditions Vth threshold voltage interrupt level 0 Min Typ Max Unit assertion 1.5 - 1.63 V de-assertion 1.55 - 1.69 V assertion 1.5 - 1.62 V de-assertion 1.55 - 1.69 V reset level 0 Vth threshold voltage interrupt level 1 assertion 1.54 - 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 12.2 12-bit ADC characteristics Table 52. 12-bit ADC static characteristics Tamb = 40 C to +105 C; 1.71 V VDD 3.6 V; VSSA = VREFN = GND. ADC calibrated at Tamb = 25C. Min Typ[2] Max Unit [3] 0 - VDDA V [4] - 5.0 - pF - 80 MHz - 5.0 5.3 Msamples/s [1][5] - 3.0 - LSB [1][5] - 4.5 - LSB [1][5] - - LSB 2.0 V VDDA 3.6 V 2.0 V < VREFP 3.6 V fclk(ADC) = 80 MHz [1][6] - 4.0 - LSB 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller [8] The full-scale error voltage or gain error (EG) is the difference between the straight-line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 41. [9] Tamb = 25 C; maximum sampling frequency fs = 5.0 Msamples/s and analog input capacitance Cia = 5 pF.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 53. ADC sampling times[1] -40 C Tamb <= 85 C; 1.71 V VDDA 3.6 V; 1.71 V VDD 3.6 V Symbol Parameter Conditions Min Typ Max Unit 20 - - ns 0.05 kΩ <= Zo < 0.1 kΩ 23 - - ns 0.1 kΩ <= Zo < 0.2 kΩ 26 - - ns 0.2 kΩ <= Zo < 0.5 kΩ 31 - - ns 0.5 kΩ <= Zo < 1 kΩ 47 - - ns 1 kΩ <= Zo < 5 kΩ 75 - - ns 15 - - ns 0.05 kΩ <= Zo < 0.1 kΩ 18 - - ns 0.1 kΩ <= Zo < 0.2 kΩ 20 - - ns 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 53. ADC sampling times[1] …continued -40 C Tamb <= 85 C; 1.71 V VDDA 3.6 V; 1.71 V VDD 3.6 V Symbol Parameter Conditions Min Typ Max Unit ADC inputs ADC_11 to ADC_6 (slow channels); ADC resolution = 10 bit ts sampling time [3] Zo < 0.05 kΩ 35 - - ns 0.05 kΩ <= Zo < 0.1 kΩ 38 - - ns 0.1 kΩ <= Zo < 0.2 kΩ 40 - - ns 0.2 kΩ <= Zo < 0.5 kΩ 46 - - ns 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller ADC R1 ADCx Cia Cio Rsw ADCy DAC Cio aaa-017600 Fig 42. ADC input impedance 12.3 Temperature sensor Table 54. Temperature sensor static and dynamic characteristics VDD = VDDA = 1.71 V to 3.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 55. Temperature sensor Linear-Least-Square (LLS) fit parameters VDD = VDDA = 1.71 V to 3.6 V Fit parameter Range Min Typ Max Unit LLS slope Tamb = 40 C to +105 C [1] - 2.04 - mV/C LLS intercept at 0 C Tamb = 40 C to +105 C [1] - 584.0 - mV [2] 520.3 - 532.7 mV Value at 30 C [1] Measured over typical samples. [2] Measured for samples over process corners.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13. Application information 13.1 Start-up behavior Figure 44 shows the start-up timing after reset. The FRO 12 MHz oscillator provides the default clock at Reset and provides a clean system clock shortly after the supply pins reach operating voltage. FRO starts FRO status internal reset VDD valid threshold = 1.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.2 Standard I/O pin configuration Figure 45 shows the possible pin modes for standard I/O pins: • • • • • Digital output driver: enabled/disabled. Digital input: Pull-up enabled/disabled. Digital input: Pull-down enabled/disabled. Digital input: Repeater mode enabled/disabled. Z mode; High impedance (no cross-bar currents for floating inputs). For initial device revision 0A (Boot ROM version 21.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.3 Connecting power, clocks, and debug functions Figure 46 shows the basic board connections used to power the LPC540xx devices, connect the external crystal and the 32 kHz oscillator for the RTC, and provide debug capabilities via the serial wire port. LPC540xx Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.8 — 22 June 2018 © NXP Semiconductors N.V. 2018. All rights reserved.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 3.3 V 3.3 V SWD connector (4) 1 (6) ~10 kΩ - 100 kΩ XTALIN SWDIO/PIO0_12 2 C1 (1) 3.3 V C2 XTALOUT DGND ~10 kΩ - 100 kΩ SWCLK/PIO0_11 3 4 5 6 n.c. 7 8 n.c. 9 10 (6) n.c. RTCXIN C3 (1) C4 RTCXOUT DGND RESETN VSS (2) VDD DGND 3.3 V 0.1 μF DGND 0.01 μF VSSA DGND LPC AGND (3) VDDA PIO0_4 ISP select pins 3.3 V 10 μF 0.1 μF PIO0_5 DGND PIO0_6 (3) VREFP ADCx (5) 3.3 V 0.1 μF 10 μF 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.4 I/O power consumption I/O pins are contributing to the overall dynamic and static power consumption of the part. If pins are configured as digital inputs, a static current can flow depending on the voltage level at the pin and the setting of the internal pull-up and pull-down resistors. This current can be calculated using the parameters Rpu and Rpd given in Table 20 for a given input voltage VI.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.5 RTC oscillator In the RTC oscillator circuit, only the crystal (XTAL) and the capacitances CX1 and CX2 need to be connected externally on RTCXIN and RTCXOUT. See Figure 47. LPC L RTCXIN RTCXOUT = CL CP XTAL RS CX1 CX2 aaa-029083 Fig 47. RTC oscillator components For best results, it is very critical to select a matching crystal for the on-chip oscillator.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.5.1 RTC Printed Circuit Board (PCB) design guidelines • Connect the crystal and external load capacitors on the PCB as close as possible to the oscillator input and output pins of the chip. • The length of traces in the oscillation circuit should be as short as possible and must not cross other signal lines. • Ensure that the load capacitors CX1, CX2, and CX3, in case of third overtone crystal usage, have a common ground plane.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.6 XTAL oscillator In the XTAL oscillator circuit, only the crystal (XTAL) and the capacitances CX1 and CX2 need to be connected externally on XTALIN and XTALOUT. See Figure 48. LPCxxxx L XTALIN XTALOUT = CL CP XTAL RS CX2 CX1 aaa-025725 Fig 48. XTAL oscillator components For best results, it is very critical to select a matching crystal for the on-chip oscillator.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 13.6.1 XTAL Printed Circuit Board (PCB) design guidelines • Connect the crystal and external load capacitors on the PCB as close as possible to the oscillator input and output pins of the chip. • The length of traces in the oscillation circuit should be as short as possible and must not cross other signal lines. • Ensure that the load capacitors CX1, CX2, and CX3, in case of third overtone crystal usage, have a common ground plane.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller LPCxxxx VDD R2 R3 USB R1 1.5 kΩ USB_VBUS USB_DP RS = 33 Ω USB_DM RS = 33 Ω D+ D- USB-B connector VSS aaa-023996 Fig 49. USB interface on a self-powered device where USB_VBUS = 5 V The internal pull-up (1.5 k) can be enabled by setting the DCON bit in the DEVCMDSTAT register to prevent the USB from timing out when there is a significant delay between power-up and handling USB traffic. External circuitry is not required.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 14. Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE (A 3) A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.1 27.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 14.1 13.9 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area A2 A E A1 detail X e1 e 1/2 e ∅v ∅w b M M C C A B C y y1 C P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 12 13 X 14 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm max nom min A A1 A2 b D E e e1 e2 v w y y1 1.20 1.06 0.95 0.40 0.35 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm B D SOT926-1 A ball A1 index area A2 E A A1 detail X e1 e ∅v ∅w b 1/2 e C M M C A B C y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 A2 b D E e e1 e2 v w y y1 mm 1.2 0.4 0.3 0.8 0.65 0.5 0.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 15. Soldering Footprint information for reflow soldering of LQFP208 package SOT459-1 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 31.300 31.300 28.300 28.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 28.500 28.500 31.550 31.550 sot459-1_fr Fig 55.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Footprint information for reflow soldering of LQFP100 package SOT407-1 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 17.300 17.300 14.300 14.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 14.500 14.500 17.550 17.550 sot407-1 Fig 56.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Footprint information for reflow soldering of TFBGA180 package SOT570-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 0.80 0.400 0.400 0.550 Hx Hy 12.575 12.575 sot570-3_fr Fig 57.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Footprint information for reflow soldering of TFBGA100 package SOT926-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR Hx Hy 0.80 0.330 0.400 0.480 9.400 9.400 sot926-1_fr Fig 58.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 16. Abbreviations Table 57.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 18. Revision history Table 58. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC540xx v.1.8 20180622 - Modifications: LPC540xx v.1.7 Modifications: LPC540xx v.1.6 Modifications: LPC540xx v.1.5 Modifications: LPC540xx v.1.4 Modifications: LPC540xx v.1.3 LPC540xx Product data sheet Product data sheet v.1.7 • Updated Figure 13 “Typical CoreMark score ((iterations/s)/MHz) vs.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Table 58. Revision history …continued Document ID Modifications: LPC540xx v.1.2 Modifications: LPC540xx v.1.1 Modifications: LPC540xx v.1 LPC540xx Product data sheet Release date Data sheet status Change notice Supersedes • Updated features in Section 7.14.8.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 21. Contents 1 2 3 3.1 4 5 6 6.1 6.2 6.2.1 6.2.2 7 7.1 7.2 7.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 5 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 6 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Block diagram . . . . . . . . . . . . . . .
LPC540xx NXP Semiconductors 32-bit ARM Cortex-M4 microcontroller 7.19 Temperature sensor . . . . . . . . . . . . . . . . . . . . 82 7.20 Security features. . . . . . . . . . . . . . . . . . . . . . . 82 7.20.1 SHA-1 and SHA-2 . . . . . . . . . . . . . . . . . . . . . 82 7.20.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 7.21 Emulation and debugging . . . . . . . . . . . . . . . . 83 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .