Datasheet

2000 Aug 25 13
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
PACKAGE OUTLINE
UNIT
A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
5.2
5.0
b
0.48
0.40
c
0.45
0.40
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
0.7
0.5
e
2.54
L
2
L
1
(1)
max.
2.5
b
1
0.66
0.56
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOD70
98-05-25
A L
0 2.5 5 mm
scale
b
c
D
b
1
L
1
L
2
d
E
Plastic near cylindrical single-ended package; 2 in-line leads SOD70
1
2
e