Datasheet

2000 Aug 25 12
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Table 5 Tape specification
Note
1. Measured over 20 devices.
SYMBOL DIMENSION
SPECIFICATIONS
REMARKS
MIN. NOM. MAX. TOL. UNIT
A
1
body width 4.4 − 4.8 − mm
A body height 5 − 5.2 − mm
T body thickness 3.6 − 4.2 − mm
P pitch of component − 12.7 −±1mm
P
0
feed hole pitch − 12.7 −±0.3 mm
cumulative pitch error −−−±0.1 note 1
P
2
feed hole centre to component
centre
− 6.35 −±0.4 mm to be measured at bottom
of clinch
F lead-to-lead distance
spread leads − 5.08 − +0.6/−0.2 mm
straight leads − 2.54 − +0.6/−0.2 mm
∆h component alignment − 01− mm at top of body
W tape width − 18 −±0.5 mm
W
0
hold-down tape width − 6 −±0.2 mm
W
1
hole position − 9 − +0.7/−0.5 mm
W
2
hold-down tape position − 0.5 −±0.2 mm
H
0
lead wire clinch height − 16.5 −±0.5 mm
H
1
component height −−23.25 − mm
L length of snipped leads −−11 − mm
D
0
feed hole diameter − 4 −±0.2 mm
t total tape thickness −−1.2 − mm t
1
= 0.3 to 0.6
F
1
, F
2
lead to snipped lead distance
spread leads − 2.54 − +0.4/−0.2 mm
straight leads − 1.27 − +0.4/−0.2 mm
H
2
clinch height − 2.5 − +0.5/0 mm
(p) pull-out force 6 −−− N