Datasheet

2000 Aug 25 10
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
PACKAGING
Sensors in SOD70 encapsulation are delivered in bulk packaging, and also reel packaging for automatic placement on
hybrid circuits and printed-circuit boards (see Figs 7 and 8).
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres. The lead-to-lead distance of types
packaged on reel is 5.08 millimetres for spread lead types and 2.54 millimetres for straight lead types.
Fig.7 Configuration of bandolier: spread leads.
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