Datasheet

5.4.2 Thermal attributes
Board type Symbol Description 64 LQFP Unit Notes
Single-layer (1s) R
θJA
Thermal
resistance, junction
to ambient (natural
convection)
59 °C/W 1, 2
Four-layer (2s2p) R
θJA
Thermal
resistance, junction
to ambient (natural
convection)
41 °C/W 1, 3
Single-layer (1s) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
48 °C/W 1,3
Four-layer (2s2p) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
35 °C/W 1,3
— R
θJB
Thermal
resistance, junction
to board
23 °C/W 4
— R
θJC
Thermal
resistance, junction
to case
11 °C/W 5
— Ψ
JT
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
3 °C/W 6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
3. Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal. For the LQFP, the board meets the JESD51-7
specification.
4. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
5. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
6. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 3, 11/2012.
Freescale Semiconductor, Inc. 21