Datasheet

JN5169M0x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.0 — 19 September 2016 19 of 27
NXP Semiconductors
JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
14.4 Soldering paste and cleaning
NXP does not recommend use of a solder paste that requires the module and PCB
assembly to be cleaned (rinsed in water) for the following reasons:
• Solder flux residues and water can be trapped by the PCB, can or components and
result in short circuits
NXP recommends use of a 'no clean' solder paste for all its module products.
Table 14. Recommended solder reflow profile
Temperature range (°C) Target time range (s)
from 25 to ~160 between 90 and ~130
from 160 to ~220 between 30 and ~60
from 220 to ~230 between 20 and ~50
from 230 to ~peak between 10 and ~20
from 25 to ~peak between 150 and ~260