Datasheet

JN5169M0x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.0 — 19 September 2016 18 of 27
NXP Semiconductors
JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
14.3 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in Figure 6 as a guide,
as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time
above liquid and ramp rates.
Fig 5. PCB placement of the JN5169-001-M00-2 modules
aaa-024222
Fig 6. Guide for reflow profile of JN5169-001-M0x-2
Time (seconds)
0
aaa-024461
100
150
50
200
250
0
20 40 60 80 100 120 140 160 180 200 220 240 260 280
Temperature
(°C)