Datasheet

Product data sheet Rev. 3.0 — 19 September 2016 17 of 27

NXP Semiconductors

JN5169-001-M0x-2

ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules

14. Footprint and PCB placement

14.1 Footprint information for reflow soldering

14.2 Optimal PCB placement of the module JN5169-001-M00-2

The JN5169-001-M00-2 module features an optimised, low cost, integrated, inverted F,

printed PCB antenna. The antenna has a vertically polarised near omnidirectional

radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in

order to increase the ground plane area which increases the antenna efficiency. This

allows stand alone operation without any additional ground plane however care must be

taken when mounting this module onto another PCB. The area around the antenna must

be kept clear of conductors or other metal objects for an absolute minimum of 20 mm.

This is true for all layers of the PCB and not just the top layer. Any conductive objects

close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and

high directivity in some directions.

The Figure 5

shows various possible scenarios. The top 3 scenarios are correct;

groundplane may be placed beneath JN5169-001-M00-2 modules as long as it does not

protrude beyond the edge of the top layer ground plane on the module PCB.

The bottom 3 scenarios are incorrect; the left-hand side example because there is

groundplane underneath the antenna, the middle example because there is insufficient

clearance around the antenna (it is best to have no conductors anywhere near the

antenna), finally the right-hand example has a battery’s metal casing in the recommended

keep out area.

All modules have the same footprint.

Fig 4. Footprint information for reflow soldering of modules

aaa-022825Dimensions in mm

2.54

1.27

3.30

1.5

Ø 1