Datasheet

Package Information and Contact Assignments
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors, Rev. 3, 11/2018
NXP Semiconductors 141
6 Package Information and Contact Assignments
This section includes the contact assignment information and mechanical package drawing.
6.1 Signal Naming Convention
The signal names of the i.MX6 series of products are standardized to align the signal names within the
family and across the documentation. Benefits of this standardization are as follows:
• Signal names are unique within the scope of an SoC and within the series of products
• Searches will return all occurrences of the named signal
• Signal names are consistent between i.MX 6 series products implementing the same modules
• The module instance is incorporated into the signal name
This standardization applies only to signal names. The ball names are preserved to prevent the need to
change schematics, BSDL models, IBIS models, and so on.
Throughout this document, the signal names are used except where referenced as a ball name (such as the
Functional Contact Assignments table, Ball Map table, and so on). A master list of signal names is in the
document, IMX 6 Series Standardized Signal Name Map (EB792). This list can be used to map the signal
names used in older documentation to the standardized naming conventions.
6.2 21 x 21 mm Package Information
6.2.1 Case FCPBGA, 21 x 21 mm, 0.8 mm Pitch, 25 x 25 Ball Matrix