Datasheet

Electrical Characteristics
i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors, Rev. 6, 11/2018
NXP Semiconductors 111
t
CDC
DDR CLK duty cycle t
CDC
= t
CPH
/ P
DDRCLK
—50%
t
CPH
DDR CLK high time 1 UI
t
CPL
DDR CLK low time 1 UI
DDR CLK / DATA Jitter 75 ps pk-pk
t
SKEW[PN]
Intra-Pair (Pulse) skew 0.075 UI
t
SKEW[TX]
Data to Clock Skew 0.350 0.650 UI
t
r
Differential output signal rise time 20% to 80%, RL = 50 Ω 150 0.3UI ps
t
f
Differential output signal fall time 20% to 80%, RL = 50 Ω 150 0.3UI ps
ΔV
CMTX(HF)
Common level variation above 450 MHz 80 Ω<= RL< = 125 Ω ——15mV
rms
ΔV
CMTX(LF)
Common level variation between 50
MHz and 450 MHz
80 Ω<= RL< = 125 Ω ——25mV
p
LP Line Drivers AC Specifications
t
rlp,
t
flp
Single ended output rise/fall time 15% to 85%, C
L
<70 pF 25 ns
t
reo
30% to 85%, C
L
<70 pF 35 ns
δV/δt
SR
Signal slew rate 15% to 85%, C
L
<70 pF 120 mV/ns
C
L
Load capacitance 0 70 pF
HS Line Receiver AC Specifications
t
SETUP[RX]
Data to Clock Receiver Setup time 0.15 UI
t
HOLD[RX]
Clock to Data Receiver Hold time 0.15 UI
ΔV
CMRX(HF)
Common mode interference beyond
450 MHz
200 mVpp
ΔV
CMRX(LF)
Common mode interference between
50 MHz and 450 MHz
—-5050mVpp
C
CM
Common mode termination 60 pF
LP Line Receiver AC Specifications
e
SPIKE
Input pulse rejection 300 Vps
T
MIN
Minimum pulse response 50 ns
V
INT
Pk-to-Pk interference voltage 400 mV
f
INT
Interference frequency 450 MHz
Model Parameters used for Driver Load switching performance evaluation
C
PAD
Equivalent Single ended I/O PAD
capacitance.
——1pF
C
PIN
Equivalent Single ended Package +
PCB capacitance.
——2pF
Table 69. Electrical and Timing Information (continued)
Symbol Parameters Test Conditions Min Typ Max Unit