Datasheet

Board type Symbol Descriptio
n
121
MAPBGA
80 LQFP 64
MAPBGA
Unit Notes
outside
center
(natural
convection)
— R
θJB_CSB
Thermal
characterizati
on
parameter,
junction to
package top
outside
center
(natural
convection)
14.6 — 19.5 °C/W 5
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
5. Thermal resistance between the die and the central solder balls on the bottom of the package based on simulation.
5.4 Peripheral operating requirements and behaviors
5.4.1 Core modules
5.4.1.1 Debug trace timing specifications
Table 52. Debug trace operating behaviors
Symbol Description Min. Max. Unit
T
cyc
Clock period Frequency dependent MHz
T
wl
Low pulse width 2 — ns
T
wh
High pulse width 2 — ns
T
r
Clock and data rise time — 3 ns
T
f
Clock and data fall time — 3 ns
T
s
Data setup 1.5 — ns
T
h
Data hold 1.0 — ns
Electrical characteristics
86
Kinetis KL82 Microcontroller, Rev. 3, 08/2016
NXP Semiconductors