Datasheet

5.3.4.1 Thermal operating requirements
Table 51. Thermal operating requirements
Symbol Description Min. Max. Unit
T
J
Die junction temperature –40 125 °C
T
A
Ambient temperature –40 105 °C
5.3.4.2 Thermal attributes
Board type Symbol Descriptio
n
121
MAPBGA
80 LQFP 64
MAPBGA
Unit Notes
Single-layer
(1s)
R
θJA
Thermal
resistance,
junction to
ambient
(natural
convection)
75.5 55 92.2 °C/W 1
Four-layer
(2s2p)
R
θJA
Thermal
resistance,
junction to
ambient
(natural
convection)
43.5 40 45.4 °C/W 1
Single-layer
(1s)
R
θJMA
Thermal
resistance,
junction to
ambient (200
ft./min. air
speed)
60.0 44 72.9 °C/W 1
Four-layer
(2s2p)
R
θJMA
Thermal
resistance,
junction to
ambient (200
ft./min. air
speed)
38.3 34 40.1 °C/W 1
— R
θJB
Thermal
resistance,
junction to
board
23.1 24 20.4 °C/W 2
— R
θJC
Thermal
resistance,
junction to
case
8.2 12 19.4 °C/W 3
— Ψ
JT
Thermal
characterizati
on
parameter,
junction to
package top
0.5 2 0.7 °C/W 4
Table continues on the next page...
Electrical characteristics
Kinetis KL82 Microcontroller, Rev. 3, 08/2016
85
NXP Semiconductors