Datasheet

150.00E
-
06
200.00E-06
250.00E-06
300.00E-06
350.00E-06
400.00E-06
450.00E-06
500.00E-06
Current Consumption (A)
VLPR Current Vs Core Freq
ALLOFF - ENABLE
ALLON - ENABLE
Cache -- CG
Temperature = 25, VDD= 3V
000.00E+00
50.00E-06
100.00E-06
150.00E-06
200.00E-06
250.00E-06
300.00E-06
350.00E-06
400.00E-06
450.00E-06
500.00E-06
1
2
4
1
-
1
-
1
-
1
1
-
2
-
2
-
2
1
-
4
-
4
-
4
Current Consumption (A)
VLPR Current Vs Core Freq
ALLOFF - ENABLE
ALLON - ENABLE
Cache -- CG
-- Core Freq
--Core:Bus:Flash:QSPI
Temperature = 25, VDD= 3V
Figure 20. VLPR mode supply current vs. core frequency
5.3.2.6
EMC performance
Electromagnetic compatibility (EMC) performance is highly dependent on the
environment in which the MCU resides. Board design and layout, circuit topology
choices, location and characteristics of external components, and MCU software
operation play a significant role in the EMC performance. The system designer can
consult the following applications notes, available on nxp.com for advice and guidance
specifically targeted at optimizing EMC performance.
• AN2321: Designing for Board Level Electromagnetic Compatibility
• AN1050: Designing for Electromagnetic Compatibility (EMC) with HCMOS
Microcontrollers
• AN1263: Designing for Electromagnetic Compatibility with Single-Chip
Microcontrollers
• AN2764: Improving the Transient Immunity Performance of Microcontroller-
Based Applications
• AN1259: System Design and Layout Techniques for Noise Reduction in MCU-
Based Systems
• KL-QRUG (Kinetis L-series Quick Reference).
Electrical characteristics
82
Kinetis KL82 Microcontroller, Rev. 3, 08/2016
NXP Semiconductors